NeXT Automates Board Assembly to Cut Manufacturing Defects Tenfold

The Machine to Build the Machines - NeXT — MuStudio

MuStudio

In-house laser inspection and dual-arm robotics compress circuit production into twenty minutes, yielding defect rates ten times lower than competing surface-mount lines.

AI-assisted summary of The Machine to Build the Machines - NeXT — original source. Check the original for full context.

Source published:

Key ideas

  • NeXT's automated circuit board manufacturing line produces a completed board in roughly twenty minutes, maintaining defect rates ten times lower than competing surface-mount boards. (1:45)
  • A proprietary in-house laser inspection station evaluates over 1,700 solder pads for height and skew to a tolerance of 1/10,000th of an inch before parts are placed. (1:45)
  • Pick-and-place robots mount components at speeds up to 150 parts per minute, using optical vision systems to position fine-pitch parts closer together than a human hair's width. (2:44)
  • The through-hole stage utilizes a dual-arm robot capable of handling approximately 70 distinct component geometries, followed by a 700-pound wave solder bath running at 255°C. (4:30)

Detailed notes

## Background Published on YouTube by MuStudio on April 9, 2011, this promotional video from NeXT, Inc. showcases the company's advanced automated factory and manufacturing line. According to the description, the video illustrates the sophisticated manufacturing process where NeXT Cubes are built using NeXT Cubes.

## TL;DR The presentation provides a step-by-step walkthrough of the roughly twenty-minute automated manufacturing process used to produce NeXT circuit boards. It details initial solder paste stenciling and a proprietary laser inspection system that verifies over 1,700 solder pads to achieve historically low defect rates. Two sequential pick-and-place robots rapidly seat surface-mount parts with extreme precision before the board undergoes a 215°C reflow oven cycle. Assembly concludes with a dual-arm through-hole insertion robot, a 700-pound wave solder bath, and an environmentally sound cleaning station to yield a finished workstation board.

## Atmosphere & style The presentation carries a polished, technologically optimistic tone characteristic of elite computing showcases, framed by a confident and authoritative narrator. Each mechanical step is depicted with quiet awe, emphasizing micron-level precision, robotic choreography, and unmatched quality control. Watching the sequence evokes the feeling of stepping inside an immaculate, futuristic laboratory where mechanical elegance and computing power seamlessly reinforce one another.

## Bulletin - [01:45](https://www.youtube.com/watch?v=dSj6kvv7_Sg&t=105s) NeXT's automated circuit board manufacturing line produces a completed board in roughly twenty minutes, maintaining defect rates ten times lower than competing surface-mount boards. - [01:45](https://www.youtube.com/watch?v=dSj6kvv7_Sg&t=105s) A proprietary in-house laser inspection station evaluates over 1,700 solder pads for height and skew to a tolerance of 1/10,000th of an inch before parts are placed. - [02:44](https://www.youtube.com/watch?v=dSj6kvv7_Sg&t=164s) Pick-and-place robots mount components at speeds up to 150 parts per minute, using optical vision systems to position fine-pitch parts closer together than a human hair's width. - [04:30](https://www.youtube.com/watch?v=dSj6kvv7_Sg&t=270s) The through-hole stage utilizes a dual-arm robot capable of handling approximately 70 distinct component geometries, followed by a 700-pound wave solder bath running at 255°C.

## Key takeaways - [01:45](https://www.youtube.com/watch?v=dSj6kvv7_Sg&t=105s) The entire manufacturing cycle of a NeXT circuit board takes approximately twenty minutes from initial stencil to final cleaning. - [01:45](https://www.youtube.com/watch?v=dSj6kvv7_Sg&t=105s) NeXT's solder paste screen printer operates with roughly 1,000 times the precision of traditional silk-screening methods. - [01:45](https://www.youtube.com/watch?v=dSj6kvv7_Sg&t=105s) NeXT designed and built its own proprietary robotic laser inspection station to verify solder application before mounting components. - [01:45](https://www.youtube.com/watch?v=dSj6kvv7_Sg&t=105s) The laser paste inspector checks height and skew on over 1,700 individual pads to within one ten-thousandth of an inch. - [01:45](https://www.youtube.com/watch?v=dSj6kvv7_Sg&t=105s) Pre-placement inspection enables NeXT to achieve a surface-mount defect rate ten times lower than the industry standard. - [02:44](https://www.youtube.com/watch?v=dSj6kvv7_Sg&t=164s) The primary pick-and-place robot places active and passive components on silver solder pads 1/100th of an inch high at 150 parts per minute. - [02:44](https://www.youtube.com/watch?v=dSj6kvv7_Sg&t=164s) A second pick-and-place robot utilizes an optical vision system to seat fine-pitch parts closer together than the thickness of a human hair. - [02:44](https://www.youtube.com/watch?v=dSj6kvv7_Sg&t=164s) A computer-controlled reflow oven strips surface oxides and heats the board to a uniform peak temperature of 215°C to form solder bonds. - [04:30](https://www.youtube.com/watch?v=dSj6kvv7_Sg&t=270s) Through-hole assembly is automated by an articulated dual-arm robot capable of feeding, orienting, and inserting roughly 70 different component shapes. - [04:30](https://www.youtube.com/watch?v=dSj6kvv7_Sg&t=270s) Boards undergo liquid flux deoxidation before crossing a wave solder station containing 700 pounds of molten solder maintained at 255°C. - [04:30](https://www.youtube.com/watch?v=dSj6kvv7_Sg&t=270s) A final environmentally sound washing system purges leftover flux and chemical residues to complete board production.

## Detailed walkthrough ### [01:45](https://www.youtube.com/watch?v=dSj6kvv7_Sg&t=105s) Solder Paste Stenciling and Laser Paste Inspection

The production of a NeXT board is a highly automated manufacturing process that takes approximately twenty minutes from start to finish. The circuit board begins its journey at the screen printer, where a specialized robot stencils the solder paste required to hold surface-mount components in position. While the narrator notes that the underlying technique is conceptually identical to silk screening t-shirts, this machine performs the task with roughly 1,000 times greater accuracy.

From the screen printer, the board transitions immediately to the paste inspector—a proprietary robotic station designed and built in-house at NeXT. Utilizing an advanced laser measuring system, the inspector performs a quality assurance check unprecedented in contemporary electronics assembly. It scans the height and skew of more than 1,700 individual solder pads to verify that each one is accurate to within one ten-thousandth of an inch before any surface components are positioned. Catching variances before part placement drastically cuts down on manufacturing errors, as the narrator observes: “It's given NeXT a defect rate 10 times lower than any other surface mounted board.”

- **Total assembly duration:** Approximately 20 minutes per board. - **Screen printer precision:** Roughly 1,000 times more accurate than standard silk-screening methods. - **Solder pad inspection scope:** Verifies height and skew across over 1,700 solder pads. - **Inspection tolerance:** Precise to within 1/10,000th of an inch. - **Defect rate performance:** 10 times lower defect rate compared to competing surface-mount boards.

[02:44](https://www.youtube.com/watch?v=dSj6kvv7_Sg&t=164s) High-Speed Pick-and-Place and Reflow Soldering

Once inspected, the board proceeds through two sequential pick-and-place robotic workstations. The first high-speed robot populates the smallest active and passive components—including miniature transistors, capacitors, and integrated circuits—guided by locational coordinates programmed directly at NeXT. Working atop silver solder pads that stand merely one-hundredth of an inch high, this unit operates as the fastest, most consistent, and most accurate robot in its class, placing parts at a rate of 150 components per minute. The board then advances to the second pick-and-place station, which handles fine-pitch components. This machine uses an optical vision system capable of mounting parts with extraordinary spatial precision, seating them closer to one another than the thickness of a human hair.

```mermaid flowchart TD accTitle: NeXT Board Manufacturing Process accDescr: Sequence of automated assembly steps from solder application through final cleaning.

subgraph SMT ["Surface-Mount Technology (SMT) Line"] A["Screen Printer<br/>(Solder paste stencil)"] --> B["Paste Inspector<br/>(Laser measurement)"] B --> C["First Pick & Place<br/>(150 parts/min)"] C --> D["Second Pick & Place<br/>(Vision-guided fine-pitch)"] D --> E["Computer-Controlled Oven<br/>(Deoxidize & reflow at 215°C)"] end

subgraph ThroughHole ["Through-Hole & Finishing Line"] E --> F["Through-Hole Robot<br/>(Two specialized arms)"] F --> G["Liquid Flux Application<br/>(Deoxidation)"] G --> H["Wave Solder Station<br/>(Molten solder at 255°C)"] H --> I["Cleaning System<br/>(Flux & residue removal)"] end ```

The populated board is transferred directly into a computer-controlled reflow oven. The thermal cycle first strips away any lingering surface oxides from the component leads, exposing bare tin and copper to guarantee the strongest possible metallurgical bond. The oven then brings the board to a uniform peak temperature of 215° Celsius, liquefying the solder to form reliable joints. When the board emerges from the oven, the surface-mount technology (SMT) stage is fully finished, having achieved an industry-leading density of components matched with rigorous quality control standards.

- **Silver solder pad height:** Approximately 1/100th of an inch high. - **Primary pick-and-place throughput:** 150 components per minute. - **Fine-pitch placement tolerance:** Distances closer than the width of a human hair. - **Reflow oven peak temperature:** Uniformly heated to 215°C.

[04:30](https://www.youtube.com/watch?v=dSj6kvv7_Sg&t=270s) Through-Hole Insertion, Wave Soldering, and Final Cleaning

Following surface mounting, the board moves onto the through-hole assembly line. An automated through-hole insertion robot mounts larger odd-form parts using an articulated dual-arm setup: one arm selects the designated part while the opposite arm grips and seats the leads directly into the corresponding board perforations. Working in tandem, the two arms can feed, orient, and insert around 70 distinct component geometries across a range of complex operations.

Before the newly inserted through-hole leads can be bonded, the board receives a coating of liquid flux to eliminate any remaining surface oxides. It then travels across the wave solder station, which the narrator colorfully describes as a miniature Niagara Falls made of 700 pounds of molten solder held at 255° Celsius. Once swept across the crest of the molten wave, the fully assembled circuit board enters an environmentally sound washing system that strips off residual flux and chemical impurities. The narrator concludes with high praise for the finished hardware, declaring: “The board emerges ready to power the most advanced, most sophisticated, most efficiently produced computer workstation of all time: NeXT.”

- **Through-hole robotic handling:** Dual-arm mechanism accommodating approximately 70 components of differing shapes and sizes. - **Wave solder capacity:** 700 pounds of molten solder. - **Wave solder operating temperature:** 255°C. - **Finishing step:** Environmentally sound wash station removing all leftover flux and process residues.

## Mentioned NeXT, Inc., NeXT Cube, Niagara Falls

## Video description Promotion video from NeXT, Inc. about their factory and manufacturing process, where NeXT Cube make NeXT cube...

[Source](https://www.youtube.com/watch?v=dSj6kvv7_Sg)

中文简报

NeXT推行电路板组装自动化,将制造缺陷减少九成 自主研发的激光检测与双臂机器人将电路生产压缩至20分钟,缺陷率较竞争对手的表面贴装生产线降低十倍。 本次演示逐步介绍了生产NeXT电路板所采用的约20分钟全自动制造流程。内容详述了初始锡膏印刷,以及一套对超过1,700个焊盘进行核查的专有激光检测系统,该系统助其实现了历史新低的缺陷率。随后,两台串联的贴片机器人以极高精度快速安放表面贴装元器件,接着电路板进入215°C的回流焊炉。组装最后通过一台双臂通孔插件机器人、一个700磅的波峰焊锡炉以及环保型清洗台完成,最终产出成品的工控站/工作站电路板。 NeXT的自动化电路板生产线在大约20分钟内即可产出一块成品板,其缺陷率比竞争对手的表面贴装电路板低十倍。 (1:45) 在元器件贴装前,自主研发的专有激光检测台会对超过1,700个焊盘的高度和倾斜度进行评估,公差精度达万分之一英寸。 (1:45) 贴片机器人以高达每分钟150个元件的速度安装部件,并利用光学视觉系统将细间距元件以小于一根头发丝宽度的间距紧密排列。 (2:44) 通孔插件阶段采用了一台能够处理约70种不同元件几何形态的双臂机器人,随后进入运行温度为255°C的700磅波峰焊锡炉。 (4:30)

Detailed notes — zh

## Background 本视频由 YouTube 频道 MuStudio 于 2011 年 4 月 9 日上传发布。视频内容源自 NeXT 公司的官方宣传片,记录了其现代化工厂与尖端制造工艺,展现了用 NeXT 计算机制造 NeXT Cube 的自动化工业奇迹。 ## TL;DR 视频系统呈现了 NeXT 计算机主板仅需 20 分钟的高度自动化制造工序。整个流程始于超高精度的焊膏丝网印刷,并借助 NeXT 自研的激光检测系统以万分之一英寸的严苛公差扫描 1700 多个焊盘,在源头将缺陷率降至行业十分之一。随后,高速贴片机与微距视觉机器人协同完成精密元件贴装,通过 215 摄氏度计算机控制回流炉实现高密度冶金结合。最后,双机械臂通孔插装机与 700 磅液态锡构成的波峰焊系统完成异形件焊接及环保清洗,打造出当时工业界最精密的工作站主板。 ## Atmosphere & style 全片洋溢着 20 世纪末硅谷先锋科技特有的自信与严谨,充满冷峻而优雅的现代工业美学。解说员的声音沉稳坚定、掷地有声,辅以“发丝级精度”与“700磅锡水尼亚加拉大瀑布”等生动比喻,将枯燥的电路制造描摹得气势磅礴。伴随着高速机械臂精准舞动的微距特写,整部影片带给观众一种见证未来被精确雕琢而出的震撼与造物秩序感。 ## Bulletin - [01:45](https://www.youtube.com/watch?v=dSj6kvv7_Sg&t=105s) NeXT 主板的完整自动化制造周期大约仅需 20 分钟,涵盖表面贴装(SMT)与通孔插装(THT)全流程。 - [01:45](https://www.youtube.com/watch?v=dSj6kvv7_Sg&t=105s) NeXT 自主研发的激光检测系统在贴装前对超过 1700 个焊盘进行扫描,公差控制在万分之一英寸内,使主板缺陷率比同类表面贴装电路板降低整整 10 倍。 - [02:44](https://www.youtube.com/watch?v=dSj6kvv7_Sg&t=164s) 贴装产线结合了每分钟 150 件的高速贴片机与对准精度超越发丝粗细的视觉细间距贴片机,兼顾生产效率与极限元器件密度。 - [04:30](https://www.youtube.com/watch?v=dSj6kvv7_Sg&t=270s) 通孔装配采用能兼容约 70 种异形件的双机械臂插装机,随后通过 700 磅、255 摄氏度的波峰焊接系统完成高品质冶金结合。 ## Key takeaways - [01:45](https://www.youtube.com/watch?v=dSj6kvv7_Sg&t=105s) 整块 NeXT 主板从裸板印刷到最终成型,全自动化制造流程耗时仅约 20 分钟。 - [01:45](https://www.youtube.com/watch?v=dSj6kvv7_Sg&t=105s) 第一步丝网印刷采用高精度模板印刷焊膏,其制造精度比普通 T 恤丝印高出约 1000 倍。 - [01:45](https://www.youtube.com/watch?v=dSj6kvv7_Sg&t=105s) 自主研发的焊膏检测机器人开行业先河,在放置元器件前通过激光核验 1700 多个焊盘的高度与倾斜度。 - [01:45](https://www.youtube.com/watch?v=dSj6kvv7_Sg&t=105s) 前置激光质控将焊盘公差严格限制在万分之一英寸内,使缺陷率仅为行业同类产品的十分之一。 - [02:44](https://www.youtube.com/watch?v=dSj6kvv7_Sg&t=164s) 一级贴片机具备同类机器人最高的一致性与速度,以每分钟 150 个零件的速率贴装预先数字化的微型元器件。 - [02:44](https://www.youtube.com/watch?v=dSj6kvv7_Sg&t=164s) 二级细间距贴片机搭载机器视觉对准系统,其元器件贴装间距的误差控制比人类头发丝更小。 - [03:44](https://www.youtube.com/watch?v=dSj6kvv7_Sg&t=224s) 计算机控制的回流炉先溶解元器件引脚与焊盘表面的氧化物,保留纯净的铜和锡接触面以提供最佳附着力。 - [03:44](https://www.youtube.com/watch?v=dSj6kvv7_Sg&t=224s) 回流炉均匀加热至 215 摄氏度形成坚固冶金结合,使 NeXT 主板达到当时计算机业界最高的元件集成密度与质控标准。 - [04:30](https://www.youtube.com/watch?v=dSj6kvv7_Sg&t=270s) 通孔插装工位采用分工协同的双机械臂系统,分别负责抓取料件与精确压入孔位,能够兼容约 70 种异形零件。 - [04:30](https://www.youtube.com/watch?v=dSj6kvv7_Sg&t=270s) 波峰焊工作站配备装有 700 磅、255 摄氏度熔融焊锡的锡槽,以“锡水瀑布”冲刷完成通孔引脚的牢固焊接。 - [04:30](https://www.youtube.com/watch?v=dSj6kvv7_Sg&t=270s) 波峰焊前采用液体助焊剂脱氧,焊接完成后通过环保清洗系统彻底清除所有化学助焊剂与加工残留物。 - [04:30](https://www.youtube.com/watch?v=dSj6kvv7_Sg&t=270s) 高度自动化的精密制造产线,为 NeXT 计算机工作站实现极致的工艺精密性与生产效率奠定了基础。 ## Detailed walkthrough ### [01:45](https://www.youtube.com/watch?v=dSj6kvv7_Sg&t=105s) 焊膏丝印与激光检测系统 整个 NeXT 主板的完整制造周期大约需要 20 分钟。制造流程的第一步是将电路板送入丝网印刷机(Screen Printer)。该设备通过精准模板在电路板上印刷焊膏,用于后续固定电子元器件;解说员指出,其原理与制作 T 恤的丝网印刷非常相似,但精度要高出大约 1000 倍。紧接着,印刷完成的电路板会停留在焊膏检测仪(Paste Inspector)前,这是一台由 NeXT 自主研发并制造的检测机器人。 这套检测设备采用了行业首创的激光测量系统,能够赶在任何元器件被贴装到底板之前,全面扫描并核对焊盘的印刷状态。解说员强调了这一创新的独特价值,指出:“It's a laser measuring system which does what no one had ever thought of doing before: it checks the height and skew of over 1,700 solder pads making sure they're perfect to within 1 10,000th of an inch before any parts are put down.”(这是一套激光测量系统,它完成了以往从没有人想过要做的事:在放置任何零件之前,检查超过 1700 个焊盘的高度和倾斜度,确保它们的误差在万分之一英寸以内)。得益于这种事前拦截缺陷的严格品控,NeXT 主板的缺陷率比当时业内其他任何表面贴装电路板低了整整 10 倍。 - 完整制程耗时:约 20 分钟 - 焊膏印刷精度:比传统 T 恤丝网印刷高约 1000 倍 - 焊盘检测规模:超过 1700 个焊盘,公差严格控制在万分之一英寸(1/10,000 inch)以内 - 质量表现:缺陷率仅为同类表面贴装主板的十分之一 ```mermaid flowchart TD accTitle: NeXT 主板自动化制造工序流程图 accDescr: 展示从焊膏印刷、贴片、回流焊接,到通孔插装、波峰焊及最终清洗的完整硬件制造流程。 subgraph SMT["表面贴装技术 (SMT) 阶段"] A["丝网印刷焊膏"] --> B["自主研发激光检测<br/>(校准 1700+ 焊盘)"] B --> C["一级高速贴片机<br/>(150 件/分钟)"] C --> D["二级视觉微距贴片机<br/>(发丝级精度)"] D --> E["计算机控制回流炉<br/>(215°C 冶金结合)"] end subgraph THT["通孔插装与后处理阶段"] E --> F["双机械臂通孔插装机<br/>(兼容 70 种异形件)"] F --> G["液体助焊剂去氧化"] G --> H["波峰焊接站<br/>(700 磅 255°C 锡水)"] H --> I["环保清洗系统<br/>(清除助焊剂残留)"] end ``` ### [02:44](https://www.youtube.com/watch?v=dSj6kvv7_Sg&t=164s) 贴片机器人与双重贴装流程 通过激光检测后,电路板进入由两台贴片机组成的安装工序。第一台贴片机负责高速放置最小尺寸的晶体管、电容器以及集成电路芯片,这些元件的坐标尺寸全部预先在 NeXT 完成了数字化编程。主板上细小的银色焊盘高度大约仅有百分之一英寸,而这台机器人展现了极高的工业制造水准。解说员评价道:“This isn't only the fastest, it's also the most consistent and accurate robot of its kind, placing parts at the rate of 150 per minute.”(这不仅是同类型机器人中速度最快的,也是一致性最高、精度最准的,贴装速度高达每分钟 150 个零件)。 随后,电路板被送至第二台贴片工作站。该工位专门负责安装引脚间距极细的高密度元器件。这台设备搭载了先进的机器视觉系统,能够在极度狭窄的空间内进行精准定位与装配,其元件贴装间距的误差控制范围甚至比一根人类头发丝的直径还要小。 - 焊盘高度基准:约百分之一英寸(1/100 inch) - 高速贴片速率:每分钟贴装 150 个微型元器件 - 细间距贴片系统:集成视觉对准技术,贴装间距精度超越发丝粗细 ### [03:44](https://www.youtube.com/watch?v=dSj6kvv7_Sg&t=224s) 计算机控制回流炉与表面贴装成型 完成元件贴装的主板接着被传送进一台完全由计算机控制的回流焊接炉中。在升温过程中,炉内环境首先溶解并去除附着在元器件引脚与焊盘表面的氧化物,使得底板仅露出纯净的锡与铜材质,从而为 NeXT 主板奠定最优良的焊接附着条件。紧接着,整块电路板被均匀加热至 215 摄氏度,促使焊料与元件管脚融为一体,形成坚固而完美的冶金结合界面。 当主板从回流炉中缓缓移出时,标志着整个表面贴装(SMT)阶段全部结束。解说员自豪地宣称:“When the NeXT board emerges from the oven, the surface mount process is complete; it's emerged with the highest density of components combined with the highest production quality controls in the computer industry.”(当 NeXT 电路板从回流炉出来时,表面贴装制程便大功告成;它集成了计算机工业界最高密度的元器件布局,以及最高标准的生产质量控制)。 - 表面去氧化机制:利用化学反应去除氧化物,保留纯锡与纯铜界面 - 回流炉加热温度:均匀升温至 215°C(Centigrade) - 制造标准:兼具业界最高元器件集成密度与严苛的质控标准 ### [04:30](https://www.youtube.com/watch?v=dSj6kvv7_Sg&t=270s) 通孔插装、波峰焊接与最终清洗 离开回流炉后,电路板进入通孔元件插装机器人(Through-Hole Insertion Robot)的工作台,顾名思义,它专门负责将各类通孔元器件安装到主板预留的插孔中。该设备配备了两条各司其职的专用机械臂:一条负责在料架上抓取并挑选合适零件,另一条则精准地将零件针脚压装插入主板孔位。这两只机械臂相辅相成,能够高效处理大约 70 种形态各异、尺寸不同的零件,并连续执行一系列复杂的机械装配动作。 主板的下一步是波峰焊工作站(Wave Solder Station)。解说员用极其生动的比喻描绘了这个场景:“Simply, it's Niagara Falls with 700 pounds of 255° Centigrade molten solder, but before the through-hole components are soldered, the board is deoxidized with liquid flux to ensure high-quality bonds.”(简单来说,这就是由 700 磅、255 摄氏度熔融焊锡构成的‘尼亚加拉大瀑布’,但在焊接这些通孔元件之前,主板会先用液体助焊剂进行去氧化处理,以确保极高品质的结合)。在翻滚的焊锡“瀑布”冲刷过后,结构完整的电路板进入一套环保型清洗系统,彻底剥离并冲洗掉所有残留的助焊剂与化学污渍。 清洗烘干出厂的主板,至此完全准备就绪。解说员最后总结道,这块主板将成为核心动力,去驱动“有史以来最先进、最精密、制造效率最高的计算机工作站”(the most advanced, most sophisticated, most efficiently produced computer workstation of all time)——NeXT。 - 通孔插装臂配置:双机械臂分工协同,兼容约 70 种不同外形与尺寸的元器件 - 波峰焊设备参数:容纳 700 磅、高达 255°C 的液态熔融焊锡 - 辅助与清洁工序:喷涂液体助焊剂去除氧化膜,后续经由环保清洁系统清除所有助焊剂和生产残渣 ## Notable quotes > [03:44](https://www.youtube.com/watch?v=dSj6kvv7_Sg&t=224s) When the NeXT board emerges from the oven, the surface mount process is complete; it's emerged with the highest density of components combined with the highest production quality controls in the computer industry. — 解说员 ## Mentioned NeXT, NeXT Cube, NeXT 主板, 丝网印刷机, 焊膏检测仪, 激光测量系统, 表面贴装技术 (SMT), 回流焊接炉, 通孔元件插装机器人, 波峰焊工作站 ## Video description Promotion video from NeXT, Inc. about their factory and manufacturing process, where NeXT Cube make NeXT cube... [Source](https://www.youtube.com/watch?v=dSj6kvv7_Sg)

Source quotes

[3:44] 解说员: When the NeXT board emerges from the oven, the surface mount process is complete; it's emerged with the highest density of components combined with the highest production quality controls in the computer industry.

Original transcript

[0:28] e [0:30] [Music] [0:38] [Music] [1:18] [Music] [1:29] la [1:34] [Music] [1:45] it takes about 20 minutes to fully build [1:47] the next board first it goes to the [1:50] screen printer this robot stencils the [1:52] solder paste that will hold the [1:53] components onto the board it's actually [1:56] very similar to the process used for [1:58] silk screening t-shirts except it's [2:00] about 1,000 times more accurate next the [2:03] board stops at the paste inspector a [2:05] robot designed and built at next it's a [2:07] laser measuring system which does what [2:09] no one had ever thought of doing before [2:11] it checks the height and skew of over [2:13] 1,700 solder pads making sure they're [2:16] perfect to within 1 10,000th of an inch [2:18] before any parts are put down it's given [2:21] next a defect rate 10 times lower than [2:23] any other surface mounted [2:24] [Music] [2:28] board [2:44] next the board goes to the first of two [2:46] pick and place robots this one places [2:48] the smallest transistors capacitors and [2:50] integrated circuits on the board from [2:52] locational Dimensions programmed at next [2:56] those Silver solder pads you're looking [2:57] at are about 100th of an inch [3:00] high this isn't only the fastest it's [3:03] also the most consistent and accurate [3:05] robot of its kind placing Parts at the [3:08] rate of 150 per [3:09] [Music] [3:22] minute next the board travels to the [3:24] second pick and place station it places [3:26] fine pitched Parts using a vision system [3:29] that can accurately Mount components [3:30] within closer proximity than the width [3:32] of a human [3:44] hair next the board is sent into a [3:47] computer controlled oven which first [3:49] dissolves any oxides that may be on the [3:51] components this leaves only pure tin and [3:54] copper to ensure that the next board has [3:56] the best solder joints then the board is [3:58] uniformly heated to 215° Centigrade [4:01] making a perfect metallurgical joint [4:03] with the [4:05] solder when the next board emerges from [4:08] the oven the surface mount process is [4:11] complete it's emerged with the highest [4:14] density of components combined with the [4:16] highest production quality controls in [4:18] the computer [4:18] [Music] [4:28] industry [4:30] next the board arrives at the through [4:32] hole insertion robot which places as its [4:35] name implies any through hole components [4:37] onto the board it has two specialized [4:40] arms one chooses the part the other [4:43] inserts it into the [4:45] board together they can handle about 70 [4:48] parts of all different shapes and sizes [4:50] and perform a number of complex [4:58] operations [5:16] next the board arrives at the wave Sader [5:19] station simply it's Niagara Falls with [5:21] 700 lb of 255° Centigrade molten solder [5:26] but before the through hoold components [5:28] are soldered the bo is deoxidized with [5:30] liquid flux to ensure high quality [5:34] bonds then it's over the [5:36] [Music] [5:54] falls next the fully constructed board [5:56] enters an environmentally sound cleaning [5:58] system that removes all flux and [6:01] [Music] [6:12] residue the board emerges ready to power [6:15] the most advanced most sophisticated [6:18] most efficiently produced computer [6:19] workstation of all [6:21] time [6:22] [Music] [6:28] next [6:35] [Music]