杜克大学团队造AI闭环造芯系统 提振二维半导体良率30%

半导体的未来:从新材料到新芯片,AI能否推动自身进化?|硅谷101年度线下大会 — 硅谷101

硅谷101

通过让模型避开材料缺陷定制晶体管并自主制造物理芯片,AI与硬件将形成软硬一体的“自生智能”闭环演化。

AI-assisted summary of 半导体的未来:从新材料到新芯片,AI能否推动自身进化?|硅谷101年度线下大会 — original source. Check the original for full context.

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Key ideas

  • 传统硅基材料在厚度降至5纳米以下时面临严重漏电与电子迁移率断崖式下滑,当前产业界的“2纳米/1纳米”等指标本质上是通过NanoSheet堆叠实现的公称节点,而非单一物理沟道尺寸。 (5:00)
  • 杜克大学团队开发了由大模型与计算机视觉驱动的智能体系统,不仅能以99.7%的良率识别二维材料缺陷,还与Google DeepMind合作实现了根据实验室硬件自适应生成合成配方的闭环科研。 (15:00)
  • 针对二维半导体缺陷密集的落地瓶颈,团队打破统一光刻范式,让AI在纳米级健康区域定制非均质晶体管,将原始材料仅65.6%的制造良率提升了约30%。 (25:00)
  • 演讲者提出“自生智能”(Autogenic Intelligence)概念,探讨由AI设计并制造承载自身算力的芯片闭环,并借生物学“向蟹化”(Carcinization)设问软硬件协同演化是否终将趋同。 (26:30)

Detailed notes

## Background 该视频由Bilibili频道“硅谷101”于2026年10月27日发布,记录了在硅谷101 Alignment 2026年度线下大会上杜克大学助理教授Harry Wang的公开演讲。演讲围绕摩尔定律的物理极限展开,探讨了下一代半导体二维材料的研发困境、AI如何介入材料表征与芯片制造全流程,并提出了软硬件共生演化的“自生智能”假说。

## TL;DR Harry Wang从晶体管微缩的物理瓶颈讲起,指出硅材料在5纳米以下因漏电和电子迁移率暴跌面临极限,而二硫化钼等超薄二维材料虽具备优异特性却受制于极低的制备良率。为此,其团队结合Meta SAM大视觉模型与Google DeepMind的Co-Scientist智能体架构,实现了让AI自主文献检索、合成配方生成及微观材料缺陷检测的端到端自动化。更进一步,团队颠覆传统均一化光刻思路,利用AI规避材料缺陷定制非均质芯片,使晶体管阵列良率提升约30%,并由此延伸出由模型与实体硬件闭环演进的“自生智能”(Autogenic Intelligence)乃至软硬件是否会走向“向蟹化趋同演化”的前沿猜想。

## Atmosphere & style 整场演讲呈现出硬核前沿学术与硅谷式风趣幽默交织的轻快氛围。主讲人以“水龙头”等通俗比喻拆解复杂的物理机制,并不时穿插现场设备卡顿时的即兴自嘲、调侃博士生与导师关系的俏皮段子,现场互动频繁且充满笑声。叙事节奏层层递进,从微观的材料缺陷一路推演至宏观的硅基生命与生物演化哲学,既有工业级落地的冷静现实感,又洋溢着对技术终极形态的浪漫畅想。

## Bulletin - [05:00](https://www.bilibili.com/video/BV12FxK6oEug?t=300s) 传统硅基材料在厚度降至5纳米以下时面临严重漏电与电子迁移率断崖式下滑,当前产业界的“2纳米/1纳米”等指标本质上是通过NanoSheet堆叠实现的公称节点,而非单一物理沟道尺寸。 - [15:00](https://www.bilibili.com/video/BV12FxK6oEug?t=900s) 杜克大学团队开发了由大模型与计算机视觉驱动的智能体系统,不仅能以99.7%的良率识别二维材料缺陷,还与Google DeepMind合作实现了根据实验室硬件自适应生成合成配方的闭环科研。 - [25:00](https://www.bilibili.com/video/BV12FxK6oEug?t=1500s) 针对二维半导体缺陷密集的落地瓶颈,团队打破统一光刻范式,让AI在纳米级健康区域定制非均质晶体管,将原始材料仅65.6%的制造良率提升了约30%。 - [26:30](https://www.bilibili.com/video/BV12FxK6oEug?t=1590s) 演讲者提出“自生智能”(Autogenic Intelligence)概念,探讨由AI设计并制造承载自身算力的芯片闭环,并借生物学“向蟹化”(Carcinization)设问软硬件协同演化是否终将趋同。

## Key takeaways - [00:00](https://www.bilibili.com/video/BV12FxK6oEug?t=0s) 晶体管底层逻辑如同水龙头开关,其缩放定律(Scaling Law)推动芯片集成度跨越至英伟达Blackwell架构的2000亿颗规模。 - [05:00](https://www.bilibili.com/video/BV12FxK6oEug?t=300s) 物理层面的漏电机制要求导电沟道“越薄越好”,但硅材料在5纳米以下难以维持导电性能,逼近其物理缩放极限。 - [05:00](https://www.bilibili.com/video/BV12FxK6oEug?t=300s) 以单层厚度约0.65纳米的二硫化钼(MoS2)为代表的二维半导体,成为突破5纳米以下极限的关键候选材料。 - [10:00](https://www.bilibili.com/video/BV12FxK6oEug?t=600s) 二维半导体商用化的核心瓶颈在于良率:CVD生长的材料缺陷较多,无法直接匹敌传统12英寸硅片10至12个9的纯度。 - [10:00](https://www.bilibili.com/video/BV12FxK6oEug?t=600s) 团队研发的Atomic系统通过大语言模型调度显微镜并结合Meta SAM视觉模型,实现纳米尺度材料缺陷的自动化定位与分割。 - [15:00](https://www.bilibili.com/video/BV12FxK6oEug?t=900s) 利用Prompt工程构建的无须重训Agentic视觉系统,对二维薄片的识别良率达到99.7%,并能精细检出肉眼易忽略的畴界缺陷。 - [20:00](https://www.bilibili.com/video/BV12FxK6oEug?t=1200s) 与Google DeepMind合作的Co-Scientist架构将文献检索、方案推理与本地硬件参数结合,突破了实验配方跨平台难以复现的痛点。 - [23:00](https://www.bilibili.com/video/BV12FxK6oEug?t=1380s) 颠覆传统整齐划一的光刻模式,AI能够避开缺陷因地制宜设计晶体管,开创“每个晶体管都不相同”的非均质制造范式。 - [25:00](https://www.bilibili.com/video/BV12FxK6oEug?t=1500s) 在低质量二维材料衬底上,AI闭环控制微纳制造设备将器件制备良率提升约30%,促成了团队成立初创公司探索AI原生半导体制造。 - [26:30](https://www.bilibili.com/video/BV12FxK6oEug?t=1590s) 超越软件层面的递归自我改进(RSI),让AI物理制造运行自身硬件的完整闭环被称为“自生智能”(Autogenic Intelligence)。 - [28:18](https://www.bilibili.com/video/BV12FxK6oEug?t=1698s) 借用生物学中的“向蟹化”(Carcinization)概念,引发关于未来软硬件一体化硅基生命走向无限发散还是收敛趋同的哲学思考。

## Detailed walkthrough ### [00:00](https://www.bilibili.com/video/BV12FxK6oEug?t=0s) 芯片缩放定律与“晶体管即水龙头”模型

杜克大学助理教授 Harry Wang 在硅谷101 Alignment 2026 大会开场,简要回顾了个人的求学与科研经历:他在上海交通大学完成本科学业,随后分别在麻省理工学院(MIT)和加州理工学院(Caltech)学习交流各一年,并在大约三年前于杜克大学建立了自己的独立实验室。针对现场观众,Harry Wang 幽默地将当天的分享定位为一堂通俗易懂的“Silicon 101(硅基半导体基础课)”。他指出,当前 AI 正在反哺芯片设计与硬件创新,形成了一种双向共生的循环:“AI needs chips and chips needs AI.”

```mermaid flowchart LR accTitle: AI与芯片的闭环进化关系 accDescr: 展示AI应用对更强算力芯片的渴求,与AI反向赋能芯片设计、材料研发的共生闭环关系。 AI["AI 算法与模型"] -->|"需要更高算力支持"| Chip["先进半导体芯片"] Chip -->|"提供底层算力硬件"| AI AI -.->|"赋能设计、材料表征与制造"| Chip ```

在芯片最底层,不论上层构建的神经网络架构多么庞大复杂,其最基础的核心元器件始终是晶体管(Transistor)。Harry Wang 将晶体管的运作机理形象地比喻为一个家庭常见的水龙头(faucet):当水龙头打开时,电流像水流一样从源极(Source)流向漏极(Drain),从而在物理上实现“0”和“1”之间的逻辑开关切换。整个半导体行业的演进一直遵循着一种物理层面的缩放定律(Scaling Law),即在单颗芯片上堆叠越多的晶体管,芯片的计算性能就越强劲。以英伟达的 Blackwell 架构芯片为例,单颗芯片中集成的晶体管开关数量已经突破了2000亿颗(200 billion)。从20世纪50年代笨重的早期晶体管,到微米级器件,再到纳米尺度的 FinFET(鳍式场效应晶体管)和 NanoSheet(纳米片架构),芯片工业一直在将开关单元推向极致的物理微缩。

- 晶体管的底层物理机制:通过源极(Source)到漏极(Drain)的电荷通断,映射为数字世界的二进制开关(0 与 1)。 - 集成规模飞跃:以先进的英伟达 Blackwell 芯片为例,单一芯片内部集成了约 2000 亿颗晶体管。 - 架构微缩演变路径:早期分立晶体管 $\rightarrow$ 微米级平面器件 $\rightarrow$ 纳米级 3D 架构(FinFET、NanoSheet)。

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[05:00](https://www.bilibili.com/video/BV12FxK6oEug?t=300s) 传统硅基的物理瓶颈与二维半导体破局

当晶体管持续向更小尺度微缩时,严重的物理失效问题随之而来。Harry Wang 再次借助水龙头模型解释“漏电”(leakage)现象:如果水龙头阀体底部的半导体材料太厚,即使在逻辑“关断”(off state)状态下,电子也不会老老实实切断流动,而是会从材料底层直接渗透溜走。这种漏电会导致严重的静态功耗浪费并产生巨大的焦耳热(thermal problem)。为了彻底关闭漏电路径,半导体结构的核心法则便是“既要更小,也要更薄(smaller is better and thinner is better)”,必须把导电沟道做得极薄,才能在关断时不漏电、开启时顺畅导通。

```mermaid flowchart TD accTitle: 传统体硅与超薄二维半导体的微缩对比 accDescr: 解释硅材料在缩微到5纳米以下时因漏电和迁移率骤降失效,而单原子层二维半导体能保持高迁移率。 subgraph Silicon_Issue ["传统硅材料(Silicon)"] S1["体材料较厚"] --> S2["关断状态下发生底层漏电 (Leakage)"] S3["微缩至 5nm 以下"] --> S4["电子迁移率急剧下降,导通性能恶化"] end subgraph 2D_Solution ["二维半导体(如 MoS2)"] T1["单分子层厚度约 0.65 nm"] --> T2["极薄沟道彻底杜绝关断漏电"] T3["原子级厚度限制"] --> T4["在 5nm 以下仍保持高电子迁移率"] end ```

然而,传统硅(Silicon)材料正面临难以逾越的物理极限。Harry Wang 明确断言:“Silicon currently has some problem. The reason is if we basically cannot shrink silicon infinitely.”当硅基沟道厚度被削减到 5 纳米以下时,材料内部的电子迁移率(electron mobility)会断崖式下滑,导致电子在开启状态下也无法正常流过。针对业界常听到的“2纳米”、“1纳米”制程新闻,Harry Wang 澄清这些全都是“名义节点”(nominal nodes),并非指栅极或通道的真实物理尺寸为 2 纳米。现代半导体是通过 NanoSheet 这类立体结构将多层硅片垂直堆叠(例如将三层 7 纳米有效厚度等效计算为约 2 纳米),其本质类似于早期单核奔腾(Pentium)处理器向 12 核、14 核多核堆叠的发展妥协,掩盖了单一硅元件无法继续无限制微缩的事实。

为了打破这一僵局,学术界将目光投向了以石墨烯(Graphene)、二硫化钼($\text{MoS}_2$)为代表的二维半导体(2D semiconductor)。这类过渡金属硫族化合物(TMDC)具有极致的几何厚度:以单层二硫化钼为例,由一层钼原子夹在两层硫原子之间构成,其物理厚度仅有约 0.65 纳米。过去十年的学术研究已经充分证明,在 5 纳米以下的极小尺度下,基于二维材料制作的单器件性能远超传统硅基单器件。

- 漏电与发热机制:若半导体通道材料过厚,关断状态下电子会从底层穿透发生 leakage,造成功耗急剧上升与接口发热。 - 硅的物理微缩极限:厚度微缩至 5 nm 以下时,硅材料内部电子迁移率严重受损,难以作为有效导电沟道。 - 产业界的节点命名真相:当前的“2纳米/1纳米”制程属于公称代号(nominal nodes),并非单一物理几何尺寸,而是依赖 NanoSheet 堆叠技术换算得出的等效指标。 - 二维材料结构参数:以二硫化钼($\text{MoS}_2$)为例,仅包含一个钼原子层和两个硫原子层,整体物理单层厚度约为 0.65 纳米。

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[10:00](https://www.bilibili.com/video/BV12FxK6oEug?t=600s) 二维材料落地痛点:良率之壁与 AI 驱动的“微观智能”

台积电(TSMC)的技术路线图显示,半导体工艺正在从 NanoSheet 跨越到互补场效应晶体管(CFAT),并计划在不久的将来正式引入以 $\text{MoS}_2$ 为代表的二维过渡金属硫族化合物。然而,二维材料从实验室走向消费级电子产品仍面临着致命阻碍。Harry Wang 一针见血地指出核心问题:“The problem is, like, I will say just one word, it's yield, period.”

在成熟的硅工业中,通过物理提纯手段,12 英寸硅晶圆可以达到 10 个 9 乃至 12 个 9(99.9999999999%)的极致纯度,整张晶圆上可能仅存在一两处晶格堆叠缺陷。相比之下,二维材料目前通常采用化学气相沉积(CVD)法生长,气体前驱体在衬底上沉积出的超薄晶体往往缺陷密集,无法达到与硅媲美的完美度。芯片制造动辄需要集成数千亿个晶体管,哪怕只有微量缺陷导致器件失效,整颗芯片就会报废,而这正是台积电、英特尔与三星构筑的良率控制护城河。

```mermaid flowchart TD accTitle: CVD 生长与传统硅纯度对比及 AI 表征管线 accDescr: 对比硅与二维半导体的缺陷率,并展示利用大语言模型和SAM驱动显微镜自动识别缺陷的流程。 subgraph Material_Gap ["晶圆纯度与缺陷对比"] Si["12寸高纯单晶硅: 10-12个9纯度,整片晶圆仅1-2处堆叠缺陷"] TwoD["CVD生长单层二维材料: 缺陷密度高,良率难以匹配传统产线"] end subgraph AI_Workflow ["Atomic 自动化表征系统"] LLM["大语言模型 (Agent/工作流控制)"] --> Scope["硬件显微镜自动扫描"] Scope --> Vision["采集微观图像"] Vision --> SAM["Meta Segment Anything Model (SAM)"] SAM --> Detect["纳米级材料与缺陷智能分割"] end ```

在介绍二维材料特性的过程中,Harry Wang 还分享了实验室的一项趣味衍生发现:当他们把这种二维薄膜转印到柔性衬底上时,材料在光照刺激下会像尺蠖(inchworm)一样单向蠕动弯曲。他以此打趣博士生与导师的日常互动:“I'm joking with my friends, this is doing PhD, when the advisor talking with a student, they just bend a little bit. If I don't talk with them, just laying down, right?”引发现场管理层观众的笑声。

面对二维材料高缺陷率带来的良率挑战,传统半导体工业仍然高度依赖人工操作显微镜去观测材料、寻找缺陷并进行质控。两年前,Harry Wang 的团队开始探索利用 AI 介入微观制造的全新范式。不同于用天文望远镜观测宏观宇宙,纳米工程需要在极小尺度上“看清”材料。该团队去年发表了一项名为 **Atomic** 的前沿成果:当时智能体(Agent)概念尚未普适,他们构建了一套由大语言模型(LLM)控制显微镜的工作流,借助 Meta 的 Segment Anything Model(SAM)计算机视觉模型,全自动识别、分割显微镜采集到的图像,实现了无需人工干预即可在纳米尺度表征材料与精准定位缺陷的全自动化流程。

- 纯度指标悬殊:传统 12 英寸半导体级硅片纯度高达“10 到 12 个 9”,全晶圆仅有一两处堆积层错(stacking faults);而 CVD 二维半导体薄膜仍处于攻克缺陷控制的初期。 - 台积电路线图趋势:演进路径为从目前的立体堆叠纳米片(NanoSheet),逐步走向互补场效应晶体管(CFAT),未来数代将引入 2D TMDC 沟道。 - 柔性光驱动特性:实验室内制备的二维材料贴合在柔性衬底上时具备光响应形变能力,展示出如尺蠖般的单向宏观机械位移。 - Atomic 系统构成:在大模型概念早期,团队通过 LLM 调度底层硬件显微镜,结合 Meta Segment Anything Model(SAM)完成纳米材料与微观缺陷的自动识别与分割。

[15:00](https://www.bilibili.com/video/BV12FxK6oEug?t=900s) 用 AI 驱动显微镜:从像素级缺陷检测到零训练 Agent 系统

讲座进入具体实验展示环节时,现场幻灯片出现了一个小插曲:屏幕短暂停滞了一下,Harry Wang 幽默地打趣道:“This is not a response now. Maybe we should replace it to... not silicon-based thing... I think we're frozen.” 随后他解释起团队的核心突破:利用基础机器学习(如监督聚类)与视觉智能体,让显微镜自主执行材料表征与检索任务。在大模型早期,外界普遍担忧幻觉(hallucination)问题,但团队实证表明,AI 仅凭肉眼视觉级别的输入,就能高精度识别出半导体新材料并进行准确分类。该模型在材料识别上的良率/准确率达到了 99.7%;尽管目前单次推断仍需约 6 秒延迟(相比人眼的一扫即知仍有优化空间),但他们正在不断压低延迟,并在多项精细任务上全面超越人类专家。

```mermaid flowchart LR accTitle: AI-Driven Microscope Characterization Pipeline accDescr: Pipeline showing raw semiconductor flakes passing through AI pixel-level analysis to extract defect boundaries without model training. subgraph S1["Raw Inspection"] A["Optical Input (MoS2 Flakes)"] end subgraph S2["AI Perception (Agentic System)"] B["Pixel-by-Pixel Analysis"] C["Sub-domain Boundary Detection"] end subgraph S3["Evaluation & Action"] D["99.7% Classification Yield"] E["Autonomous Tool Control"] end A --> B B --> C C --> D D --> E ```

在对比测试中,人类实验员在标记二硫化钼($\text{MoS}_2$)薄片时,往往凭直觉用红框圈出大致轮廓;而 AI 模型依托逐像素(pixel-by-pixel)的精细分析,不仅能勾勒出完整薄片,还能敏锐识别出肉眼容易忽略的畴界(domain boundaries)等微观缺陷。Harry 指出这种能力并不局限于单一材料,在石墨烯等诺贝尔奖级别的二维半导体上同样适用。最关键的是,整套系统完全不需要建立庞大的数据中心进行专门重训:“Can you believe it? We don't need data center. We can just build an agentic system and do the prompts, and we can manage it to harness it for our application.” 过去两年学界热议 AI for Science,但他认为技术风向正迅速转向“AI for Engineering”,即通过 AI 大幅加速新型半导体从发现到实际制造的整个工程周期。

- **良率指标**:AI 视觉模型对二维半导体材料识别与分类的 yield 达到 99.7%。 - **响应延迟**:早期模型推断约为 6 秒,目前实验室正在持续将其压低。 - **材料覆盖**:模型成功泛化应用于 $\text{MoS}_2$(二硫化钼)以及石墨烯(Graphene)等各类二维半导体晶体。 - **架构优势**:采用 Agentic 系统结合 Prompt Engineering 驱动,免去了耗费庞大算力的数据中心级专用模型重训。

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[20:00](https://www.bilibili.com/video/BV12FxK6oEug?t=1200s) 携手 DeepMind:从文献挖掘到自主生成实验配方的“Co-Scientist”

谈及真实世界的落地难点,Harry Wang 强调,正如前一日在 AI for Science 专题研讨会上讨论的那样,物理实验验证和真实世界落地极其困难。为此,杜克大学团队与 Google DeepMind 展开深度合作(相关成果在演讲前约四周刚刚发布),将 DeepMind 提出的 Co-Scientist 架构真正引入物理实验室,搭建闭环自主实验平台。系统不仅能研读海量前沿文献并提出科学假说,更能针对特定目标预测前驱体(precursor)、制定详尽的执行方案(execution plans / protocol),并直接连接控制实验室自研的仪器设备完成端到端探索。看到 AI 能自主读文献、写方案甚至写论文,Harry 笑着调侃:“Then after I saw this work, I'm saying like, maybe you don't need a professor because AI can give ideas better than mine. So why need a professor?”

```mermaid flowchart TD accTitle: Co-Scientist Closed-Loop Experimental Architecture accDescr: Workflow from task prompt and literature retrieval to customized recipe generation and physical instrument execution. subgraph Input["Input Layer"] A["Task Description & Prompt"] B["Lab Geometry & Setup Parameters"] end subgraph Brain["Co-Scientist Reasoning"] C["Literature Review & Idea Hypothesizing"] D["Precursor & Protocol Generation"] end subgraph Execution["Physical Execution"] E["Automated Instrument Control"] F["Human-in-the-loop (Weighing & Sealing)"] G["Synthesized 2D Material"] end A --> C B --> D C --> D D --> E E --> F F --> G ```

当前系统中仍保留了一定程度的人机协同(human-in-the-loop),比如实验员仍需亲手称量前驱体、装填石英管并密封,但未来这些流程完全可由机械臂替代。该系统解决了一个困扰学术界已久的顽疾——“实验可重复性极差”。由于各实验室的管式炉几何结构、加热温区和管道尺寸千差万别,论文中公开发表的配方换到新设备上往往无法复现。而 Co-Scientist 只要输入当前实验室具体的几何结构与硬件参数,便能自适应调整并输出定制化配方(customized recipe)。Harry 分享了一个真实案例:他曾催促学生合成某种新材料,学生原本诉苦说“看文献至少要耗费几星期”,他便建议尝试让大语言模型直接生成配方,结果一次试验就成功跑通:“Can you just try to use large language model and try a recipe, and let's see whether it works?” 这不仅为研究省下了数月摸索时间,更证明了 AI 具备“一次试样即达工业级合成”(one shot / first trial)的潜力。

- **合作团队**:杜克大学 Harry Wang 实验室联合 Google DeepMind。 - **硬件协同**:软件层直接对接自研实验机台,人机协同(手工称料与封管)逐步向机械臂全自动化过渡。 - **跨平台复现突破**:将实验室的具体空间几何与设备硬件作为输入参数,使 AI 能够将文献通用参数重构为专属于本地机台的定制配方。

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[23:00](https://www.bilibili.com/video/BV12FxK6oEug?t=1380s) 颠覆均一化光刻:让 AI 在充满缺陷的材料上定制非均质芯片

在成功实现了“用 AI 观测材料”和“用 AI 生长材料”之后,Harry Wang 展示了团队尚未公开发表的前沿进展:直接让 AI 动手制造芯片。传统半导体工业对衬底晶圆的洁净度有着近乎苛刻的要求,如果将布满黑点与微观缺陷的非理想二维材料送给产业界晶圆厂,对方会毫不客气地判定为毫无价值的废料:“If I give this material to the industry partner, they will say this is crap. Okay, you can never grow any chips on top of that.”

然而,团队反其道而行之,故意在实验中选用缺陷密布的“非理想”合成材料。借由显微镜与 AI 系统的视觉联动,算法能够逐片扫描整块衬底,精细避开所有缺陷区域,自主挑选出最完美的健康纳米区域来“因地制宜”地制造晶体管。

传统硅基芯片的生产逻辑是依靠均质化光刻,在整片晶圆上整齐划一地排布数十亿颗物理尺寸完全一致的晶体管;但在杜克大学团队打造的全新制造范式下,AI 打破了这一规则——“every transistor are different”,每个晶体管的摆放位置、尺寸和形态都是根据局部材料特性量身定制的。目前,团队已正式将这一 AI 决策系统连接至超净间(cleanroom)的全套半导体制造设备,直接调度微纳加工机台,在充满缺陷与随机性的新型二维半导体上成功完成了芯片实物的物理构建。

[25:00](https://www.bilibili.com/video/BV12FxK6oEug?t=1500s) AI赋能半导体制造:从良率飞跃到初创落地

通过让AI全面接管并控制半导体制造流程,团队在基础芯片构建上取得了突破性的良率提升。传统的二维材料本身质量欠佳,直接制备的良率极低,仅有大约65.6%,“which is crap”。然而,通过AI算法识别缺陷并进行针对性制造,即使构建在原本低良率的材料之上,团队依然成功实现了高良率的晶体管阵列(transistor arrays)。这种约30%的良率跃升展现了巨大的颠覆性潜力。演讲者断言:“So, this 30%, around 30% increase, we think it will wholly, like, will change and disrupt the whole manufacturing, semiconductor manufacturing in the future. That's my belief.”

基于这一科研进展,团队在大会前约一个月前成立了一家初创公司,旨在探索“AI原生半导体制造”(AI-native semiconductor manufacturing)的落地可能。公司计划切入良率智能化(Yield Intelligence)以及实验室到晶圆厂的方案(Lab-to-Fab Solutions),甚至尝试为新型二维半导体打造一条小型的先导试验线(pilot line)。演讲者调侃道,如今无论行业内讨论多么火热的数据中心或大模型,大家最终赚到的钱其实都付给了台积电(TSMC):“So all your money pay to TSMC in the end, right?”正因如此,制造芯片才是AI革命中成本最高、最关键的一环,而团队的目标正是提供一种颠覆性的、更加便宜的半导体制造替代路径。

- 原始二维材料直接制备的初始良率仅为65.6%,属于无法规模化商用的水平。 - 引入AI闭环控制制造后,芯片/晶体管阵列良率提升了约30%。 - 初创团队的核心业务方向:AI原生半导体制造、良率智能化、Lab-to-Fab解决方案、2D半导体小规模先导试验线。

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[26:30](https://www.bilibili.com/video/BV12FxK6oEug?t=1590s) 闭环飞轮与“自生智能”(Autogenic Intelligence)的诞生

随着AI模型的演进,业界近来频繁讨论递归自我改进(Recursive Self-Improvement, RSI)。然而,演讲者指出,这里存在一个被忽视的“缺失环节”(missing link):如何让AI不仅能写代码,还能亲自制造运行自己的物理“大脑”。演讲者构建了一个核心飞轮模型:模型使用数据设计芯片、指导仪器制造芯片,制造出来的芯片反过来训练并运行更强大的模型。在人类生物学中,心灵(mind)与大脑(brain)是合二为一、无法割裂的;而当前的AI模型与底层硅基芯片却处于相互分离的状态。如果能用模型造芯片、用芯片跑模型,就诞生了一种新型的生命形态(silicon life format)。

演讲者梳理了智能演进的梯级:从传统的AI(Conventional AI),走向递归自我改进(RSI),再到大家热议的超级智能(Superintelligence, SI)。但比起单纯软件层面的超级智能,如果将芯片制造的物理实体真正纳入进化循环中,这种形态理应被称为一种全新的智能模式。演讲者将其命名为“自生智能”(Autogenic Intelligence),巧妙地把缩写重新带回“AI”,形成真正的自主闭环。正如演讲者所宣布的:“And because nobody has given a name of that, maybe I can try to give a name to bring it back to AI. I will call it autogenic intelligence. Let's go back to AI again to finish this closed loop.”

```mermaid flowchart TD accTitle: Autogenic Intelligence Closed-Loop Flywheel accDescr: 展现AI模型、芯片制造与硬件训练相互促进的自生智能闭环系统

subgraph Intelligence ["自生智能演进 (Autogenic Intelligence)"] AI["AI模型 / Mind"] -->|"设计与制造控制"| Chip["芯片硬件 / Brain"] Chip -->|"高效算力支撑"| Train["模型训练与推理"] Train -->|"反馈优化"| AI end

Data[("核心数据流")] -.->|"驱动学习"| Train Data -.->|"指导设计"| Chip ```

- 核心进化梯级:常规AI(Conventional AI) $\rightarrow$ 递归自我改进(RSI)/ 超级智能(SI) $\rightarrow$ 自生智能(Autogenic Intelligence, AI)。 - 概念映射:生物学中的 Mind 与 Brain,对应计算领域的模型(Model)与芯片硬件(Chip)。

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[28:18](https://www.bilibili.com/video/BV12FxK6oEug?t=1698s) 终极演化猜想:硅基生命走向多样化还是“趋同演化”?

当模型与芯片合二为一,软硬件共同进化的尽头究竟通往何处?演讲者借用了1916年(一百多年前)生物学上提出的“趋同演化/向蟹化演变”(Carcinization)概念。在自然界的海洋生物演化中,经历了数百万年的岁月,不同谱系的生物不论原本形态是鱼类还是海龟,其外形结构都往往不可思议地趋同演化成类似螃蟹的模样(例如帝王蟹或蓝蟹)。这种“化蟹”现象是大自然亿万年来反复上演的规律。

演讲者借此向台下观众提出了一个充满哲学与科学趣味的开放式问题:“So do you think the AI plus chips will be diverge or converge. Oh, well, that would be a crab shape of this silicon life format.” 软硬件一体化的硅基生命,未来是会走向无限发散的多样化分支,还是最终像生物界一样,受物理与逻辑规律约束而收敛到某种特定的“螃蟹形态”?在全场热烈的掌声中,演讲者以一句幽默的调侃为整个演讲作结:“So, but maybe next time when you eat the crab, you should remind us, think about it, and maybe you are eating a very intelligent animal. So with that, I conclude my talk. Thank you very much.”

## Notable quotes > [05:00](https://www.bilibili.com/video/BV12FxK6oEug?t=300s) Silicon currently has some problem. The reason is if we basically cannot shrink silicon infinitely. — Harry Wang

## Mentioned Harry Wang, 杜克大学, 硅谷101, 英伟达, Blackwell, FinFET, NanoSheet, 台积电, Google DeepMind, Meta, Segment Anything Model (SAM), 英特尔, 三星

## Video description 下一代芯片会用上什么新材料?AI又能怎样参与研发与制造? 在硅谷101 Alignment 2026大会上,杜克大学助理教授Harry Wang从晶体管和摩尔定律讲起,介绍科学家为什么开始寻找硅之外的新材料,以及这些材料为什么还没用进我们的手机和电脑。 他也分享了团队的几项研究:让AI控制显微镜、找出材料里的缺陷,再挑选合适的位置制造晶体管;与Google DeepMind合作,让AI查文献、生成实验配方,并控制仪器做实验。 从观察材料到动手制造,AI正在进入芯片研发的更多环节。演讲最后,Harry提出了“自生智能”(Autogenic Intelligence)的设想:如果AI能参与制造运行自己的芯片,模型和硬件会怎样一起进化?这种演化又会走向多样化,还是收敛到相似的结构?

大会嘉宾: Harry Wang,杜克大学助理教授

[Source](https://www.bilibili.com/video/BV12FxK6oEug)

中文简报

杜克大学团队造AI闭环造芯系统 提振二维半导体良率30% 通过让模型避开材料缺陷定制晶体管并自主制造物理芯片,AI与硬件将形成软硬一体的“自生智能”闭环演化。 Harry Wang从晶体管微缩的物理瓶颈讲起,指出硅材料在5纳米以下因漏电和电子迁移率暴跌面临极限,而二硫化钼等超薄二维材料虽具备优异特性却受制于极低的制备良率。为此,其团队结合Meta SAM大视觉模型与Google DeepMind的Co-Scientist智能体架构,实现了让AI自主文献检索、合成配方生成及微观材料缺陷检测的端到端自动化。更进一步,团队颠覆传统均一化光刻思路,利用AI规避材料缺陷定制非均质芯片,使晶体管阵列良率提升约30%,并由此延伸出由模型与实体硬件闭环演进的“自生智能”(Autogenic Intelligence)乃至软硬件是否会走向“向蟹化趋同演化”的前沿猜想。 传统硅基材料在厚度降至5纳米以下时面临严重漏电与电子迁移率断崖式下滑,当前产业界的“2纳米/1纳米”等指标本质上是通过NanoSheet堆叠实现的公称节点,而非单一物理沟道尺寸。 (5:00) 杜克大学团队开发了由大模型与计算机视觉驱动的智能体系统,不仅能以99.7%的良率识别二维材料缺陷,还与Google DeepMind合作实现了根据实验室硬件自适应生成合成配方的闭环科研。 (15:00) 针对二维半导体缺陷密集的落地瓶颈,团队打破统一光刻范式,让AI在纳米级健康区域定制非均质晶体管,将原始材料仅65.6%的制造良率提升了约30%。 (25:00) 演讲者提出“自生智能”(Autogenic Intelligence)概念,探讨由AI设计并制造承载自身算力的芯片闭环,并借生物学“向蟹化”(Carcinization)设问软硬件协同演化是否终将趋同。 (26:30)

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杜克大学助理教授 Harry Wang 在硅谷101大会上指出,传统硅基芯片正逼近物理微缩极限,而具有极薄优势的二维半导体受制于材料缺陷与良率瓶颈;通过引入 AI 接管材料表征、实验合成与非均质芯片制造,能够打破传统光刻均一性限制并大幅提升良率,推动软硬件共同进化的“自生智能”闭环。 硅基物理极限与二维材料的微缩优势 (5:00) 芯片演进依赖在晶体管内堆叠开关,如英伟达 Blackwell 架构已集成突破 2000 亿颗晶体管。当硅材料通道微缩至 5 纳米以下时,材料底层易发生严重漏电(leakage)并导致电子迁移率断崖式下滑。Harry Wang 澄清业界所谓的“2纳米”或“1纳米”仅为依赖 NanoSheet 立体堆叠换算出的公称节点(nominal nodes),并非物理栅极真实尺寸。为此,单层厚度仅约 0.65 纳米的二硫化钼(MoS2)等二维过渡金属硫族化合物,凭借其极薄沟道能够杜绝关断漏电,在 5 纳米以下展现出超越传统硅基单器件的物理性能。 良率之壁与 AI 驱动的自动化微观表征 (10:00) 台积电路线图虽规划迈向互补场效应晶体管(CFAT)并引入二维材料,但其落地面临致命的良率问题:传统 12 英寸硅晶圆纯度可达 10 至 12 个 9,全片仅一两处堆叠缺陷;而气相沉积(CVD)生长的二维材料缺陷密度极高。为此,团队开发了名为 Atomic 的工作流,利用大语言模型调度底层显微镜,结合 Meta 的 Segment Anything Model(SAM)等视觉模型进行逐像素分析。该系统在无需数据中心级专门重训的前提下,将材料与缺陷分类准确率提升至 99.7%,敏锐捕捉肉眼易漏检的畴界缺陷,推动技术走向“AI for Engineering”。 人机协同实验与颠覆均一化制造范式 (20:00) 针对跨实验室硬件差异导致实验难以复现的问题,杜克大学团队联合 Google DeepMind,将 Co-Scientist 架构接入物理机台,依据设备具体几何结构直接生成定制配方,实现了一次试样跑通目标材料合成。在芯片制造端,团队打破了传统均质化光刻要求晶体管整齐划一的规则,让 AI 逐片扫描缺陷密布的“非理想”合成衬底,自主挑选纳米健康区域按需定制每个晶体管。实验表明,传统二维材料初始制备良率仅约 65.6%,而经过 AI 闭环制造后晶体管阵列良率提升约 30%,团队已就此成立初创公司探索 AI 原生半导体制造路线。 软硬件一体化构筑“自生智能”飞轮 (26:30) 针对递归自我改进(RSI)忽视硬件制造的现状,Harry Wang 提出软件模型(Mind)与物理芯片(Brain)相融合的“自生智能”(Autogenic Intelligence)概念:模型利用数据设计并指导仪器制造芯片,新芯片反过来提供算力训练更强大的模型,形成物理实体的闭环迭代。关于这种硅基生命的未来形态,他借用生物学中多谱系物种演化收敛为蟹类的“趋同演化”(Carcinization)现象,提出了 AI 与芯片协同进化最终会走向无限发散还是收敛至某种特定形态的开放性思考。 该演讲勾勒了从二维材料微观表征到非均质芯片制造的 AI 闭环路径,并指出了约 30% 的良率提升成效;但其整体方案仍处于从小规模先导试验线向产业化过渡的早期阶段,人机协同环节尚未完全由机械臂取代,软硬件一体化进化的最终收敛形态也仍是有待验证的猜想。

Source quotes

[5:00] Harry Wang: Silicon currently has some problem. The reason is if we basically cannot shrink silicon infinitely.

Original transcript

[0:00] 过去几十年,芯片性能的提升很大程度上依赖于晶体管不断缩小,但随着传统硅基芯片逐渐逼近物理极限,半导体行业正在寻找下一代材料和制造技术。而有意思的是,AI不仅是这场技术变革的需求推动者,也可能成为下一代芯片的设计者。那么当AI开始参与制造下一代AI芯片智能的发展会走向什么方向接下来让我们回到Alignment 2026大会现场观看这场Tino的完整演讲或者是中文化的工程和工程。所以,我再次介绍一下我一部分。我叫 Harry Wang。我现在是室长的教学。我达了我的高科学学习课在上海教通学习课然后我学了一年在 MIT 我学了一年在高tech的科学and I started my lab in Duke about three years ago今天是Valley101,我先开始了我会叫做Siticon101, 和你基本上的知识, 如何是其实是用的。在最少的地方,在最少的地方,我会说,我们也看到一些新的商品AIor to boost the design of chips and everything like that. So I will say this can become a loop.AI needs chips and chips needs AI. But what are the chips and what are the basic elements of chips?所以基本上, 全部都是所以,即使所有的大量的模式和其他模式的模式变成很 complex在某些年代的一种, 但仍然是在某些年代的一种, 但仍然是在某些年代的一种。所以,如果你看到某些人的晶片, 基本的一种, 它叫做"transistor",它是比较像一个"faucet", OK?如果我们转它上,你可以看到这里, 彩虹能浮动through the source to drain and this is the very basic element and turn from zero to one one to zero and realize everything now based on the chips and based on the AIAll right, so again, we talked about the scaling law, but the scaling law is already there in silicon or in the chips.Okay, so in semiconductor, so we do believe like if we stack more transistor in a single chip, it's just be more powerful and has higher performance.Okay, here shows like from a single transistor, if we accumulate it to billions of transistors, it can become a chip and become very functional.如果我们看这个例子,如果我们看 NVIDIA Blackwell 300 AI托子,它其实有200BDNCswitches or transistors in a single chip.OKSo in that caseLike basicallyIf you haveYou want to have better chipsYou need to have moreTransistors in a singleDevice所以在那些事件中,那是很普通的问题,如何能够进入在某些股票OK?So in that case, here shows just a look back of how transistor在50年代的50年代的一年代的一年代的一年代的一年代的一年代的一年代transistor,and then shrink it down to from a micron scale to nanoscale.然后从一个比较的旅行to the we have a thin fat and then we have like nano sheet structure basically we stack everything together所以,最近有些问题,所以我们有贫贫,然后我们先放进去,但后来先放进去 [5:00] There'll be other problems such as the thermal problem, the heat. generated at these interfaces, generate some problems. Okay? So in that case, like... So I want to introduce a little bit of common failure mode of the transistor. So transistor, when you shrink it in a small scale, so sometimes there's a problem as it also happens in the faucet in your home. OK, so if it's very thick, so basically the electron sometimes not just flowing, if you turn it off. It's not flowing directly from here, but also can flow from the... underneath. So we call it leakage. So this leakage actually, that's why I consume a lot of power and waste a lot of power and generate the heat. So in that case, if you use a thick material, like very thick, like this, sometimes like the electrons can go underneath it. In that case, you have to make the material as thin as possible. So in that case, if it's thin, then we can close the faucet in the off state. No electrons can flow here. In the on state, the electrons can flow well. So in that case, I tried to give you some common concept in silicon 101 or semiconductor 101. So smaller is better for each element and thinner is better. for each element or semiconductor materials. So we already see this trend, but I want to convince you that currently the silicon has a big problem. Okay, I really value like in the previous panel, we talk about the finesse, maybe some problem or It's still going, right? But I want to convince you like the... Silicon currently has some problem. The reason is if we basically cannot shrink silicon infinitely. So if silicon goes from like pretty large scale, to shrink it to below 5 nanometer. So electrons become, the mobility and speed of electrons become slow. Or finally, like you can see, it's not flowing well. In that case, in the on state, so no electrons can flow if you basically have a really small scale of silicon. So in that case, like as a scientist, so we think it's possible to have a next generation semiconductor. We call it two-dimensional semiconductor represented by graphene, mollabium, disulfide, Nobel Prize in 2018 10? Right? So basically-- so but comparing with a two-dimensional semiconductor So two-dimensional semiconduct can keep its electron mobility or the capability of flowing electrons, even if it's below 5 nanometers. OK, so you might be feel confused that you look at the news. Actually, the semiconductor industry always tell you, oh, we now have a two nanometer node. In the future, we have one nanometer node. Why is not like what I just said is five nanometer is a limit. Right. So I want to say like every like the node numbers showing here is it's currently is all nominal nodes. That basically means like if we check like like the the structure and the history of semiconductor and transistors. So currently, we are using the nano sheet structure. Nanoseed structure, you stack the silicons. So in that case, even though you have a 7 nanometer, you have three layers. Then you have 7 over 3. That's around 2 nanometer. Okay, so similar thing we actually already seen in the Intel's original, we have Pantom, Pantom 1, Pantom 2, Pantom 3. And now we have like 12 cores or like 14 cores. So because it's hard to shrink a single element. So basically industry decided to stack more. OK, so in that case, like I want to convince you like like silicon still fundamentally has a problem. You can make it you cannot make it extremely small like like other two dimensional materials. So but this materials, as I mentioned, is only has one molecular layer. Here shows two layers. So you have one moleculum atom and two sulfur atoms on. And in total, this material has only the thickness Below one nanometer is about 0.65, 65 nanometer. So, but still as a semiconductor, it has been showed in academia in last 10 years a single device. built upon this material is much better than a single device of using the silicon to build it. okay so if we see like when this material will enter your phone into your computer become really electronics in product so this shows [10:00] The roadmap by TSMC especially shows like, so now we are at between the nanosheet structure, moving to the CFAT as I just showed to you. But in the very near future, this will go two-dimensional transition metal dichotronites, or I just showed you as MOS2. OK? So in that case-- So you might think like if this material just the material, like I tell you, it's very thin and can perform as a channel material of a transistor. So basically, so the problem is like how to build it efficiently. So even though we have some small flakes And we demonstrate single device is great, but we always need A lot of, as mentioned, hundreds of billions of transistors in a single chip. So by building this material, basically currently in the university lab, and I know there's some industry partners are working on these similar things. We use a method called chemical vapor deposition, have some two precursors. The precursor can carry with the gas and grow. this. extremely thin semiconductor on top of substrate. Okay? So the problem is like this one layer can perform really well as a channel in the transistor, but it's not like silicon. Silicon, we use a physical way to build it, so have really high purity like 10 knives or 12 knives. on a 12-inch wafer, if you check every item, So only one or two stacking forts on 12 inch wafer. However, this material is still struggling about like getting as perfect as a silicon. So if it's not as perfect as a silicon, basically the current industrial flow should be changed. So in that case, like, so I want to also to mention that this material not just can be built as semiconductor. In my lab, we also developed something. We found if we print this material on top of some soft substrate, and this material kind of responds to... to the light, you can see it's like an inch warm, can just move one direction. I'm joking with my friends, this is doing PhD, when the advisor talking with a student, they just bend a little bit. If I don't talk with them, just laying down, right? So, but we are moving, we are always moving. So, you cannot always bend, right? So, So maybe the managers are laughing, so you know what's going on. So then you're questioning, like, this material seems very magical, but why is it still not in your phone, not in your daily life? The problem is, like, I will say just one word, it's yelled, period. So TSMC is great because you can manage Yale the best in the world. Okay, and the Intel and Samsung also very good on yield management. That means like any semiconductor industry, if you want to like get a share in the industry, so the yield management is very important. That means you have to build a chip about hundreds of billion. transistor on one chip, but how do you make sure everyone is working? Everything is working, every transistor is working. So TSMC is doing great, but for this new 2D semiconductor, yield management needs some new logic, but still something like you need to solve. Basically, I will say in the whole, go back a little bit, in the whole semiconductor industry, so we still rely on human. to do the yield management and at least to see these materials, see the defects, see it's good or see it's not good. In that case, about two years ago, my lab, we started to to look at whether we can use AI to see these materials or to see the defects of these materials. So by doing this yesterday, there was a really good talk about telescope, like to see the stars and everything. This goes through a macro scale of seeing things. So in our lab, if we want to engineer in nanoscale, we have to see these small things as small as possible. So therefore, like we published paper last year, we call it atomic. We use AI, basically large language model to control a microscope and let the microscope to see these nanomaterials and characterize these nanomaterials and understand these macro materials. So the work is done two years ago. At that time, even agents as a concept was still early. So we call it a workflow. And basically, we can use a large the microscope and to segment the image captured, and we use a meta-segment anything model [15:00] And then we can use some supervisor clustering, which is a very basic Machine Learning. Don't forget machine learning is the beginning of AI. So we can teach the AI to understand what materials are there. Is that clean? Is there defects? Or is there something, just nothing there? OK? So in that case, we can see it's very interesting. This is not a response now. Maybe we should replace it too. not silicon based thing. So... I think we're frozen. But again, like basically what we did is like we can let the microscope to do the task research talks by itself. So by doing this, basically, it's possibly to we can see this is more like in the category of AI for science. Or we can say like it's actually like more like a structure of like how to use AI to actually create. see the manufacturing of the semiconductors. Okay? So, and the most importantly, we notice it's possible to So at that time, people are still questioning, is Chesapeake GPT or still have a lot of hallucination? This word recently not heard by many of the research. But at that time, the hallucination is a problem. But we validated that it's possibly to use AI to identify the material and also to finally classify the results by just seeing the material. or what are the nothing over there. OK. So basically, we found this model works really well and it's working now. Yeah, so this model works really well. So we can see like comparing the human eyes, this yield of the model can reach to 99.7, even though the latency is still a problem. The human just look at it and then you can get results. But we still need six seconds. So recently we are lowering the latency, it's working pretty well. But again, like in some tasks, it's even better than human. So, if I show the left image showing here, because I'm telling you, like asking you to label all the possible like MS2 flakes, sometimes the human will just label like this in the red, okay? But the model cannot just see. the whole flakes, but also identify some We call it domain boundaries. It's a boundary of different domains. And these boundaries are actually a kind of defect. So there's no tricks here, but because a human, we just use intuition. by our eyes, but this model, they have pixel by pixel analysis. So in some certain task, I try to convince you that AI can work definitely better than human. So we also try different kinds of materials in semiconductor. For example, showing here, like different kinds of, for example, graphene, which is a Nobel prize-winning material and all kinds of 2D semiconductors, this model works really well. And most importantly, we even don't need to train it. Can you believe it? We don't need data center. We can just build an agentic system and do the prompts, and we can manage it to harness it for our application. actually how to manufacture it, how to get it. So I will say in the last two years, AI for science is very important. And I will say soon we'll change to, I'm thinking maybe the AI for engineering will be very important. So in that case, we think for this novel semiconductors, it's possible to use AI. to speed up the discovery and speed up the manufacturing. Okay, so actually we already see the AI is very good on hypothesizing Ideas. So, Google's co-scientists actually published last year and they realized using some structure like alpha evolved. So AI can give more ideas. OK? And also, the problem is, as mentioned yesterday in the AI4Science panel-- Actual physical experiment and also the actual real-world validation is really difficult. OK? So in that case, like what we did, this paper just released a lot-- four weeks ago. So my lab collaborated with Google DeepMind. And we tried to use this co-scientist structure and add it into the physical world and the physical experiments to do the end-to-end validation and the discoveries. Okay? So basically, the idea is I want to introduce the work a little bit. [20:00] So the co-scientists now... cannot just do the research review, it can give ideas and also can do the, give the, experimental or the execution plans And also we connect our our instruments and a self-built experimental setup and let AI to control it. And now it can do the experiment by itself. Okay. So in that case, like in about one year ago, people are thinking in the future, Harry, you don't need a PhD student. Okay. Then after I saw this work, I'm saying like, maybe you don't need a professor because AI can give ideas better than mine. So why need a professor? And also it can write paper by itself. So maybe we should all work on data center. So basically, this work can do the reads literature, design experiment, validate end to end. And more importantly here, this video shows how it works. As a co-scientist geometry, you can-- can predict the precursor and also generate a protocol to actually execute it. And also like controlling some panel in the software and the human is still in the loop right now. So, so, so we have to use hands to weigh in the precursor. put it into the tube and also seal it. But maybe soon we can use a robot arm in that hallway to replace this stuff. But again, it's generated a really good recipe and even in the paper, we highly… truly believe it's possible to grow some new semiconductor never grown before. OK, even theoretically predicted, but it's very hard to grow. And for the conventional, 2D semiconductors as I showed you, MS2 and everything. So it also shows really good results. We just let AI to control the instrument. It looks at the literature and get the results. The most importantly we found I will say like in academia, many of the results are very hard to repeat because different labs have different geometry. So my lab have this furnace, have that tube, but the published result has a different setup. So in that case, like we found like AI can... work really good on how to repeat the results. That means that if we have the geometry of our lab and give it to AI, and let it look at the literature and try to see like, can you have a customized recipe using my customers instruments? It works really well. So it's actually showing here like the in is always prompt and the task description. And alt can be the directly get from the customized instruments. So basically here shows a demo. Like I try to push my student to grow. My lab is growing this material for a long time. But this material, I try to push my student to, can you grow it? Can you grow it? And my students say, oh, Dr. Wang, I have to look at literature. It takes a few weeks or something. Then one day I just say, "Can you just try to use large angle model and try a recipe, and let's see whether it works?" Then it's working. I joke with a student in the future that you don't need to even look at literature. You can just follow what models tells you. So that saves me a few months. So I try to push my students. There's a lot of mental torture for myself. But again, here shows like it's the AI can... do the, try the industrial scale manufacturing. just with one shot, or we say there's just first trial. Okay, this is also something if you want to repeat something and you have just a new setup, and AI can save your time and speed up the discovery and your research. So, basically, here shows if we go one step beyond. We already see the material. And also we can grow the material. How about we directly build the actual chip So here image showing like not published yet. So we can combine this microscope. You can see the microscope seeing some materials. we grow on which is not ideal. We on purpose chosen on non-ideal material. You can see a lot of black dots actually defects. If I give this material to the industry partner, they will say this is crap. Okay, you can never grow any chips on top of that. But if we use our AI and let AI to build it, so what AI will do is just choosing the good area. So you can see a conventional way, we have uniform transistors, billions. Okay. But if we use AI, we can see every transistor are different. And now we are connecting AI with all the cleanroom manufacturing instruments, and we can build, like, it's actually... like actually build a chip So, yeah. [25:00] champion is not beating at scale okay So we can still have thousands of transistors. But we think it's a very good beginning. So basically, we also see by taking the LED AI control, the whole semiconductor manufacturing, it's increased yield. So originally this material can only have 65.6% which is crap, but build upon this low yield material, we can have a high yield, like transistor arrays, which is very basic chips. So, this 30%, around 30% increase, we think it will wholly, like, will change and disrupt the whole manufacturing, semiconductor manufacturing in the future. That's my belief. Okay, so in that case, So in that case, basically, we recently built a startup about a month ago, and we think using AI, to interrupt the semiconductor industry will be very interesting. We think AI native semiconductor manufacturing will be more and more important. We think we will try the Yale intelligence or lab to fab solutions, or we think of like maybe we want to build a small pilot line for the new 2D semiconductors. But again, like for everyone talking about today, so all your money pay to TSMC in the end, right? So in the end, it's how to build these chips actually takes the most, even though we talk about AI, we talk a data center and everything. Now, I'll give you an alternative solution, which is cheaper, okay? So again, like I will say that AI has already rise and models. Recently, a lot of people talk about RSI, recursive self-improvement. And then like we think like building the missing link. how to use AI to manufacture its own brain is very important. So this shows like a flywheel, like if AI can design the chip, can build the chip, can train the AI, chips can train the AI with the data in the middle. So it's actually become a, more efficient like flywheel. Or I will say like the model and the chips can finally combine to each other, similar to our biological brain. So for example, our minds and our brain are never separated. But currently, the model and the chips are kind of separated. So if we combine these chips and model by using model to build chips and using a chip to run the model, so I will say this is a new format of life. Maybe we can say it's like a new format of the silicon live format, whatever you call it. Okay? And I will say like this could be the next step if we have a conventional AI, And then we have RSI. And then this RSI, maybe we can call it a super intelligence. And recently, it seems like SI is more favorable than AI. But again, if we realize put the manufacturing into the building of the chips, and I will say this could be new intelligence. And because nobody has given a name of that, maybe I can try to give a name to bring it back to AI. I will call it autogenic intelligence. Let's go back to AI again to finish this closed loop. So again, like we think if we combine the minds and the brain or the chips and models together, it's a new. And the question is, where it goes? As a professor, I always think. So basically, I want to borrow some concept discovered in 1916, about more than 100 years ago. This concept is called constant sensation. So what does it mean is like people find no matter what kind of ocean animals are after life. Millions of years, it's become a crab. So what does it mean? Like if you have a fish, millions of years... crab, maybe like king crab. So if you have a turtle, medium of years it becomes like a blue crab, for example. Right. So it's a constantization is observing our nature, mother nature for already there for billions, millions of years. Okay. So in that case, I'm thinking like I give a question for you. So do you think the AI plus chips will be... diverge or converge. Oh, well, that would be a crab shape. of this silicon life format. All right? So, but maybe next time when you eat the crab, you should remind us, think about it, and maybe you are eating a very intelligent animal. So with that, I conclude my talk. Thank you very much.