Ancient Casts Working OLED Microcomputer Inside Resin Toy Brick

Ancient

Manual edge-trimming, bodge wiring, and petroleum-jelly port barriers allow microscopic display hardware to survive direct resin encapsulation inside standard toy brick dimensions.

AI-assisted summary of Brick Assembly — original source. Check the original for full context.

Source published: 2022-12-19

Key ideas

Ancient demonstrates the full fabrication workflow for encasing a working microcomputer inside a standard-sized building brick. (1:05)
Late additions to the design, specifically an accelerometer, were hand-integrated onto the pre-manufactured PCB using ultra-fine bodge wires. (3:46)
To prevent resin ingress during encapsulation, petroleum jelly was applied inside the silicone casting mold as a temporary hydraulic dam for the USB port. (7:48)
The finished cast device houses a 0.42-inch greyscale OLED display and is capable of running software such as Doom. (9:12)

Detailed notes

## Background Published on YouTube by Ancient on December 19, 2022, "Brick Assembly" documents the creation of a functional microcomputer fitted inside a standard LEGO brick. The video compiles footage from multiple builds to showcase the entire construction process, including the integration of a 0.42-inch OLED screen capable of greyscale graphics.

## TL;DR The video documents the step-by-step fabrication of a tiny computer encased in a toy building brick. Ancient begins by mechanically trimming and prepping the custom circuit board before fluxing, tacking microscopic components, and reflowing them with hot air. An accelerometer is retrofitted into the circuit using delicate, hand-soldered bodge wires before the assembly is seated in a silicone casting mold. After protecting the female USB port with petroleum jelly, liquid resin is poured and cured, producing a self-contained, screen-equipped brick.

## Atmosphere & style The video carries an intimate, surgical workshop atmosphere driven by high-magnification macro views and minimal, understated narration. Deadpan, sparse verbal cues like "Flux..." and playful audio beats punctuate the intense focus required for ultra-fine micro-soldering. The overall experience feels both patient and whimsical, contrasting rigorous precision engineering with the nostalgic, playful form factor of a toy brick.

## Bulletin - [01:05](https://www.youtube.com/watch?v=6wBrOV2FJM8&t=65s) Ancient demonstrates the full fabrication workflow for encasing a working microcomputer inside a standard-sized building brick. - [03:46](https://www.youtube.com/watch?v=6wBrOV2FJM8&t=226s) Late additions to the design, specifically an accelerometer, were hand-integrated onto the pre-manufactured PCB using ultra-fine bodge wires. - [07:48](https://www.youtube.com/watch?v=6wBrOV2FJM8&t=468s) To prevent resin ingress during encapsulation, petroleum jelly was applied inside the silicone casting mold as a temporary hydraulic dam for the USB port. - [09:12](https://www.youtube.com/watch?v=6wBrOV2FJM8&t=552s) The finished cast device houses a 0.42-inch greyscale OLED display and is capable of running software such as Doom.

## Key takeaways - [01:05](https://www.youtube.com/watch?v=6wBrOV2FJM8&t=65s) Standard PCB manufacturing leaves a non-conductive perimeter, requiring manual board trimming so traces can sit flush within the brick casing. - [01:05](https://www.youtube.com/watch?v=6wBrOV2FJM8&t=65s) Precise mechanical preparation of the board edges is essential to satisfy the extreme space constraints of the toy brick form factor. - [02:12](https://www.youtube.com/watch?v=6wBrOV2FJM8&t=132s) Flux and localized dabs of solder were applied under magnification to anchor miniature surface-mount components before final heating. - [02:12](https://www.youtube.com/watch?v=6wBrOV2FJM8&t=132s) Hot-air reflow leveraged molten solder surface tension to pull misaligned passive components and IC pins cleanly onto their designated pads. - [03:46](https://www.youtube.com/watch?v=6wBrOV2FJM8&t=226s) An orientation-sensing accelerometer was introduced late in the project after the PCB layout had already been manufactured. - [03:46](https://www.youtube.com/watch?v=6wBrOV2FJM8&t=226s) Fine enamel-coated magnet wires were manually soldered directly from the sensor pads to microcontroller traces to avoid re-spinning the PCB. - [03:46](https://www.youtube.com/watch?v=6wBrOV2FJM8&t=226s) The hardware integrates a 0.42-inch OLED panel capable of driving greyscale imagery via custom display routines. - [07:48](https://www.youtube.com/watch?v=6wBrOV2FJM8&t=468s) Encapsulating the electronics in a silicone brick mold posed a major risk of resin seepage into the functional female USB port. - [07:48](https://www.youtube.com/watch?v=6wBrOV2FJM8&t=468s) Petroleum jelly was deployed along the mold cavity edge to seal off the USB port against capillary resin leakage without harming electrical contacts. - [09:12](https://www.youtube.com/watch?v=6wBrOV2FJM8&t=552s) A timelapse sequence captured the hardening of the liquid casting resin into a rigid, protective transparent block. - [09:12](https://www.youtube.com/watch?v=6wBrOV2FJM8&t=552s) Inspection following demolding showed a noticeable color shift in the cured polymer across different assembly takes. - [09:12](https://www.youtube.com/watch?v=6wBrOV2FJM8&t=552s) The final product operates as a fully self-contained microcomputer capable of rendering graphics and running classic games inside a transparent brick.

## Detailed walkthrough ### [01:05](https://www.youtube.com/watch?v=6wBrOV2FJM8&t=65s) Board Trimming and Initial Surface Prep

The custom circuit board designed to fit inside a standard LEGO brick form factor requires meticulous mechanical preparation before any soldering can take place. Because standard PCB manufacturing leaves a slight border of bare substrate around the perimeter, the copper traces do not run flush against the outer boundaries. Ancient notes the physical limitation directly while preparing the miniature board: “The copper doesn't go right to the edge of the board, so I need to clean it up a little.” Carefully abrading and cleaning the edges allows the compact components and edge-routed connections to sit as tightly as possible within the tight confines of the toy brick casing.

[02:12](https://www.youtube.com/watch?v=6wBrOV2FJM8&t=132s) Surface-Mount Soldering and Reflow

Once the board outline is trimmed and prepped, the assembly shifts to mounting the micro-components and display circuitry under magnification. Working at this scale requires a multi-stage soldering process to prevent parts from shifting out of alignment. Ancient begins applying chemical aid, stating simply, “Flux...” before tacking down the microscopic passives and integrated circuits. To prevent parts from blowing away or migrating across pads during final heating, Ancient explains his technique: “Dabs of solder to hold everything in place.”

After securing the components with preliminary solder anchors, the board undergoes a hot-air reflow pass. Ancient describes the goal of this thermal pass as being to “...then reflow it and make it neat,” letting surface tension pull every resistor, capacitor, and microcontroller pin cleanly onto its respective pad without bridging.

```mermaid flowchart LR accTitle: PCB Assembly and Reflow Process accDescr: Step-by-step workflow showing PCB edge preparation through reflow soldering. subgraph Prep ["Preparation"] A["Trim & clean board edges"] --> B["Apply flux"] end subgraph Solder ["Component Placement"] B --> C["Tack components with dabs of solder"] C --> D["Hot-air reflow & cleanup"] end ```

[03:46](https://www.youtube.com/watch?v=6wBrOV2FJM8&t=226s) Bodge-Wiring the Accelerometer

Even with a dedicated board layout, late design revisions require manual intervention on the hardware. An orientation sensor had to be retrofitted into the circuit after the original layout was already committed to copper. Ancient explains the retrofit: “The accelerometer was a late addition and needs some thin wires to connect up.” Using ultra-fine enamel-coated magnet wire (bodge wire), individual leads are soldered by hand from the microscopic sensor pads directly to the appropriate microcontroller traces. During this delicate assembly work under the iron, an abrupt, playful pop or burst interrupts the process with an exclamation of “*pow*” as the circuit elements are nudged into place.

- The display integrated into the build is a tiny 0.42-inch OLED panel capable of rendering greyscale imagery. - The bodge wires allow the retrofitted accelerometer to integrate with the host processor without requiring an entirely new board fabrication run.

[07:48](https://www.youtube.com/watch?v=6wBrOV2FJM8&t=468s) Mold Preparation and Resin Ingress Prevention

With the electronics, screen, and wiring fully verified and functioning, the assembly moves to encapsulation. The completed electronic core is seated inside a silicone casting mold shaped like a classic building brick. A primary hazard during liquid resin casting is the potential fouling of the female USB port, which must remain open and functional for power and data programming. To seal off the connector cavity against capillary leakage, Ancient coats the opening, remarking, “Adding some vaseline to the mould, to stop resin getting into the USB port.” The petroleum jelly forms a temporary hydraulic dam that resists the liquid polyurethane or epoxy without damaging the internal electrical contacts.

```mermaid flowchart TD accTitle: Encapsulation and Casting Workflow accDescr: Process of protecting the port, casting in resin, and curing the brick. subgraph MoldPrep ["Mold Setup"] A["Apply petroleum jelly to USB port"] --> B["Seat electronics in brick mold"] end subgraph Casting ["Resin Pour & Cure"] B --> C["Pour liquid casting resin"] C --> D["Timelapse of curing phase"] D --> E["Demold finished brick"] end ```

[09:12](https://www.youtube.com/watch?v=6wBrOV2FJM8&t=552s) Timelapse Curing and Resin Demolding

The curing phase of the encapsulation process is captured via an accelerated sequence labeled simply “Timelapse.” Over the course of the cure, the liquid mixture hardens into a solid, transparent brick, encasing the 0.42" OLED display, board, and retrofitted sensor into a permanent block. Upon inspecting the demolded piece under the workshop lights, a distinct visual shift in the cast polymer is immediately apparent, prompting Ancient to observe: “It changed colour!” The finished brick emerges as a fully self-contained microcomputer capable of driving dynamic graphics and running classic software directly on its tiny embedded screen.

## Mentioned Ancient, LEGO, Doom, uGrey, AliExpress

## Video description The making of a computer-in-a-brick.

I've chopped out sections that went on a bit, but tried to leave in enough of everything to show the whole process.

Edited together from a few different builds, so there's some continuity errors with the resin colour at the end.

Code for driving the screen in greyscale is here: https://github.com/AncientJames/uGrey The screen is a 0.42" OLED, available from aliexpress or similar. Yes it runs Doom. https://www.youtube.com/watch?v=TJHSMpYi8bg

[Source](https://www.youtube.com/watch?v=6wBrOV2FJM8)

中文简报

Ancient将可运行的OLED微型电脑浇铸入树脂玩具积木中通过手动边缘修剪、飞线连接以及凡士林接口防护屏障，微型显示硬件得以在标准玩具积木尺寸内经受直接树脂封装。该视频记录了将一台微型电脑封装入玩具积木中的完整制作步骤。Ancient首先对定制电路板进行机械修整和前期处理，随后涂抹助焊剂、点焊固定微型元件并使用热风枪进行回流焊接。接着，他使用精细的手工焊接飞线将加速度计改装接入电路，之后将整个组件放入硅胶浇铸模具中。在用凡士林对USB母口进行防护后，倒入液体树脂并固化，最终制成了一块自带屏幕的独立积木。 Ancient展示了将一台可运行的微型电脑封装入标准尺寸积木中的完整制作流程。 (1:05) 设计中后期追加的元件（特别是加速度计）是通过超细飞线手工集成到预先制成的PCB上的。 (3:46) 为防止封装过程中树脂渗入，硅胶浇铸模具内部涂抹了凡士林，作为USB接口的临时液压阻隔屏障。 (7:48) 最终浇铸完成的设备内置一块0.42英寸的灰度OLED显示屏，并能够运行诸如《毁灭战士》（Doom）等软件。 (9:12)

Reading summary

Ancient outlines the process of embedding a functional microcomputer, display, and orientation sensor into a standard LEGO brick form factor through custom PCB trimming, micro-soldering, and protective resin casting. Mechanical Preparation and Surface-Mount Reflow (1:05) Because standard printed circuit board fabrication leaves an unetched substrate border around the perimeter, the board requires mechanical grinding before components can fit flush against the miniature brick casing. Ancient notes that the copper does not reach the outer boundary, necessitating edge trimming and surface cleaning. Once prepped, assembly requires multi-stage micro-soldering under magnification. Ancient applies flux and preliminary dabs of solder to anchor microscopic passive components and integrated circuits, preventing them from shifting or blowing away. A final hot-air reflow pass leverages surface tension to pull the components neatly onto their respective pads without solder bridging. Retrofitting Accelerometer Hardware via Bodge Wiring (3:46) Design revisions after board manufacturing required integrating an orientation sensor directly into the existing circuit. Ancient explains that the accelerometer was a late addition needing thin wire connections to link up with the host processor. To avoid a complete PCB redesign, ultra-fine enamel-coated magnet wire was hand-soldered from the microscopic pads of the sensor to the microcontroller's traces. The retrofitted circuit operates alongside a 0.42-inch OLED panel capable of rendering greyscale imagery within the compact assembly. Connector Sealing and Resin Encapsulation (7:48) The verified electronics core is encased inside a silicone brick mold to form a solid, transparent unit. To prevent liquid casting resin from entering the female USB port and ruining power and programming functionality, Ancient applies petroleum jelly as a hydraulic barrier around the connector cavity before pouring the polymer. Following a timelapse curing phase, the liquid mixture hardens into a rigid block encasing the board, display, and retrofitted sensor. Upon demolding the finished piece, Ancient observes that the cast polymer undergoes a noticeable color change, yielding a self-contained microcomputer capable of running dynamic graphics on its embedded screen. The build illustrates how mechanical abrasion, manual bodge wiring, and temporary port masking can bypass standard PCB manufacturing constraints to produce fully functional microcomputing devices within highly restricted toy enclosures.

精炼阅读摘要

Ancient 记录了将定制微型计算机系统装配并封装进标准乐高（LEGO）积木尺寸外壳的完整制作流程。整个工艺通过手工打磨、微距焊接、飞线改装以及树脂灌封防渗，克服了极端微型化空间中的机械与电气限制。极小空间电路板修整与贴片回流焊接 (1:05) 为了让定制印刷电路板（PCB）严丝合缝地嵌入乐高积木的狭小腔体内，组装前必须进行细致的边缘机械打磨。由于标准 PCB 加工后外围留有未覆铜的裸基板边缘，Ancient 明确指出需要清理未布铜的板边，以保证紧凑元器件和边缘走线能够贴近积木外壳轮廓。随后的表面贴装在放大镜下进行，为防止微小元件与集成电路在热风加热时移位，Ancient 采用分步焊接法，先涂抹助焊剂并以少量焊锡固定各元器件，再通过热风枪进行回流焊接，利用焊锡表面张力使引脚规整复位，避免短路与虚焊。后期加速度计飞线改装与屏幕配置 (3:46) 在硬件打样完成后，该项目在后期临时追加了方向感知功能。Ancient 解释称加速度计为后期补充元件，需要细导线进行连接。在没有重新打样 PCB 的情况下，组装者使用极细的漆包线（飞线）在烙铁下手工将微型传感器焊盘直接焊接至微控制器的相应走线上。与此同时，该核心模块整合了一块 0.42 英寸的灰度 OLED 显示屏，在免去整体电路重新制版成本的同时，完成了传感器与主控芯片之间的信号贯通。接口凡士林阻隔与树脂固化脱模 (7:48) 在电路与显示验证完毕后，核心电子单元被移入乐高积木造型的硅胶模具中进行树脂封装。为保证供电与编程所必需的母口 USB 接口不被液体浇铸树脂渗入，Ancient 在模具开口处涂布凡士林构建物理屏障，成功利用其抗渗特性阻断了毛细渗透，保护了内部电气接触点。经过延时拍摄记录的硬化固化阶段，脱模后的透明聚合物呈现出明显的色泽转变（Ancient 观察到其发生变色），最终形成了一块具备独立驱动图形与运行经典软件能力的实体透明智能积木。该制作展示了通过边缘打磨、手工飞线修补与凡士林注模防渗等技术手段，在严苛空间公差内实现高密度电子元件封装的可行性；但作为单件手工改造方案，其高度依赖细微手工作业与临时防护工艺，在大规模复制或标准化量产上仍受工艺局限。

Detailed notes — zh

## Background 该视频由创作者 Ancient 于 2022 年 12 月 19 日发布在 YouTube 平台。视频简介说明了制作“积木电脑”（computer-in-a-brick）的完整过程，内容由多次不同制作尝试剪辑而成，并附带了用于驱动 0.42 英寸 OLED 灰度屏幕的开源代码链接，还特别提及这块微型电脑确实能够运行《DOOM》。 ## TL;DR 视频记录了将一台微型电脑塞入标准乐高积木并完成树脂灌封的全过程。作者首先清理了 PCB 边缘以适配微小公差，接着通过助焊剂点焊定位微型贴片元件并进行热风回流焊接。随后，作者为临时追加的加速度计进行了精细的手工漆包线飞线连接，最后在模具内涂抹凡士林保护 USB 接口免遭树脂渗入，完成了整体浇筑固化，让嵌入 0.42 英寸 OLED 屏幕的积木电脑成功点亮并运作。 ## Atmosphere & style 整个视频展现出极致专注且充满极客浪漫的工匠氛围。微距镜头下纤细漆包线与焊锡的微米级交锋，营造出屏气凝神的紧张感，而穿插的幽默音效又适时化解了微型手工的压迫感。看着树脂在延时摄影中缓缓凝固变色、屏幕最终透过透明积木清晰亮起，带给观众一种踏实而令人惊叹的硬核造物治愈感。 ## Bulletin - [01:05](https://www.youtube.com/watch?v=6wBrOV2FJM8&t=65s) 创客 Ancient 成功将包含微型主板与 0.42 英寸 OLED 屏幕的完整电脑系统嵌入并灌封至标准乐高积木尺寸的树脂块中，并成功运行《毁灭战士》（Doom）。 - [02:12](https://www.youtube.com/watch?v=6wBrOV2FJM8&t=132s) 针对极小公差的微型组装，作者采用“先打磨修整边缘铜箔、涂覆助焊剂点焊固定、再热风回流”的工艺来确保贴片元件的机械与电气稳定性。 - [03:46](https://www.youtube.com/watch?v=6wBrOV2FJM8&t=226s) 为在未预留引脚的 PCB 上扩展姿态感知功能，硬件后期通过手工微米级漆包线飞线成功接入微型加速度计。 - [07:48](https://www.youtube.com/watch?v=6wBrOV2FJM8&t=468s) 树脂灌封工艺中采用凡士林作为致密隔离保护层，有效防止液态环氧树脂在灌注与固化过程中渗入 USB 接口造成损坏。 ## Key takeaways - [01:05](https://www.youtube.com/watch?v=6wBrOV2FJM8&t=65s) 标准乐高积木的内部容积极度受限，微型硬件制作的第一步是对 PCB 板边缘覆铜和基材进行人工修整打磨以消除机械干涉。 - [01:05](https://www.youtube.com/watch?v=6wBrOV2FJM8&t=65s) 显示模块选用了 0.42 英寸微型 OLED 屏幕，并配合开源的 uGrey 驱动代码实现灰度图像输出。 - [02:12](https://www.youtube.com/watch?v=6wBrOV2FJM8&t=132s) 面对细微元器件无法逐脚手工烙铁焊接的痛点，采用先点焊假固定、再全局热风回流的方案可避免元件移位或被热风吹飞。 - [02:12](https://www.youtube.com/watch?v=6wBrOV2FJM8&t=132s) 高质量助焊剂对于微型焊盘至关重要，它能消除表面氧化层并依靠熔融焊锡的表面张力实现引脚自对准，杜绝虚焊和短路。 - [03:46](https://www.youtube.com/watch?v=6wBrOV2FJM8&t=226s) 由于 PCB 原始设计未预留传感器引脚，作者后期采用手工高精度漆包线飞线方式接入微型加速度计芯片。 - [03:46](https://www.youtube.com/watch?v=6wBrOV2FJM8&t=226s) 漆包线飞线操作极其考验烙铁控温与微操作精度，既要保证极细焊盘牢固连接，又不能烫坏绝缘漆导致短路烧毁。 - [07:48](https://www.youtube.com/watch?v=6wBrOV2FJM8&t=468s) 将凡士林涂覆在模具与 USB 接口结合处，利用其高粘度与疏水性构建起阻挡低粘度液态树脂渗漏的防护隔离层。 - [07:48](https://www.youtube.com/watch?v=6wBrOV2FJM8&t=468s) 环氧树脂在模具内的交联固化过程伴随放热与颜色转变，最终将所有裸露电路与屏幕一体化浇筑成坚固的半透明积木砖体。 ## Detailed walkthrough ### [01:05](https://www.youtube.com/watch?v=6wBrOV2FJM8&t=65s) 电路板边缘清理与微型焊接准备在制作积木内部的微型电脑时，PCB 的物理尺寸必须精确塞入乐高积木的极小公差空间内。由于打样加工的覆铜层并没有完全延伸到电路板的最外边缘，作者需要先进行精细的人工修整与清理，正如 Ancient 指出的那样：“The copper doesn't go right to the edge of the board, so I need to clean it up a little.” 只有彻底打磨并去除多余的板边阻焊和基材边缘，才能确保后续在积木腔体内的贴合度，同时保证边缘走线和微小元件不会受到机械干涉。 ```mermaid flowchart TD accTitle: 积木微型电脑组装流程 accDescr: 展示从 PCB 打磨修整、元件点焊回流、加速度计飞线，到模具灌封保护的完整硬件制作步骤。 subgraph S1["电路板组装与焊接"] A["修整 PCB 边缘覆铜"] --> B["涂抹助焊剂并点焊固定"] B --> C["热风回流焊接整形"] C --> D["加装加速度计并手工飞线"] end subgraph S2["模具封装与固化"] E["USB 接口涂抹凡士林防护"] --> F["放入模具注入树脂"] F --> G["延时固化完成"] end D --> E ``` - 核心元件包括一块 0.42 英寸微型 OLED 屏幕（支持灰度驱动显示）与微型控制主板。 - 板边覆铜修整是确保板级天线、接地或空间装配公差符合严苛外壳空间要求的关键一步。 --- ### [02:12](https://www.youtube.com/watch?v=6wBrOV2FJM8&t=132s) 助焊剂涂抹与表面贴装元件的定位回流微型电路板上的贴片元件尺寸极为细小，无法直接用烙铁逐脚手工焊接。Ancient 先在焊盘区域涂覆适量助焊剂，随后通过焊锡点焊将微型元器件逐一临时定位，防止在移动或加热过程中发生位移。他在操作中描述道：“Flux... Dabs of solder to hold everything in place...then reflow it and make it neat.” 在所有核心被动元件与芯片贴片被轻点固定之后，再使用热风枪进行均匀加热，促使焊锡表面张力发挥作用完成自对准回流，焊点随即变得光亮整洁、圆润饱满。 - 焊接策略采用“先点焊假固定、再全局回流”的方式，避免微小元件被热风吹飞。 - 高质量的助焊剂不仅能消除表面氧化层，还赋予熔融焊锡极好的润湿流动性，使微型焊盘间不产生虚焊与短路。 --- ### [03:46](https://www.youtube.com/watch?v=6wBrOV2FJM8&t=226s) 临时追加加速度计与精密漆包线飞线在核心电路焊接完毕后，作者对硬件功能进行了扩展，临时在狭小的电路板背部或空隙中追加了一颗微型加速度计芯片。因为原始 PCB 设计没有给这颗传感器预留直接贴装的引脚，只能依赖极细的漆包飞线手动连接。Ancient 解释道：“The accelerometer was a late addition and needs some thin wires to connect up.” 面对微米级引脚间距的高难度手工焊接，整个操作极其考验手法精度，视频中甚至穿插了伴随火花音效的幽默定格“*pow*”，生动展现了在显微级空间下飞线焊接的高压与挑战。 - 加速度计的加入让微型积木电脑具备了姿态感知与晃动交互能力。 - 采用细如发丝的绝缘漆包线引出电源、接地与 I2C/SPI 通信引脚，要求极高的手工烙铁控制力，以避免烫穿绝缘层造成短路。 --- ### [07:48](https://www.youtube.com/watch?v=6wBrOV2FJM8&t=468s) 模具凡士林防护与树脂灌封固化当电路板、0.42 英寸 OLED 显示屏及飞线完全调试完毕后，整套微电脑需要被整体灌封在透明乐高积木的环氧树脂之中。为了防止液态树脂在灌注与固化过程中顺着开口渗入 Micro-USB / Type-C 接口内部导致插孔报废，Ancient 在将电路放入硅胶模具前采取了严密的防护措施：“Adding some vaseline to the mould, to stop resin getting into the USB port.” 凡士林作为致密防水防渗隔离层，能在不损伤接口触点的前提下彻底阻挡未固化的树脂渗入。随后，作者通过延时摄影记录了树脂的注入与漫长的硬化过程。在固化反应放热与化学结构稳定的双重作用下，灌封材料的色泽发生了明显变化，作者不禁感叹：“It changed colour!” 最终，屏幕与电路完全凝固在一枚标准的半透明乐高积木内部，不仅结构坚固，还能直接透过正面砖体清晰点亮显示并流畅运行游戏。 - 凡士林利用高粘度和疏水性阻断低粘度液态树脂渗漏，固化完成后易于清理。 - 视频由多次实际制作样机混剪而成，在延时摄影中树脂颜色的转变不仅直观展示了化学交联固化的物理过程，也体现了业余硬件极客精益求精的打磨历程。 ## Mentioned Ancient, 乐高 (LEGO), 0.42 英寸微型 OLED 屏幕, Doom, uGrey, AliExpress, 加速度计, USB 接口, 凡士林, 环氧树脂 ## Video description The making of a computer-in-a-brick. I've chopped out sections that went on a bit, but tried to leave in enough of everything to show the whole process. Edited together from a few different builds, so there's some continuity errors with the resin colour at the end. Code for driving the screen in greyscale is here: https://github.com/AncientJames/uGrey The screen is a 0.42" OLED, available from aliexpress or similar. Yes it runs Doom. https://www.youtube.com/watch?v=TJHSMpYi8bg [Source](https://www.youtube.com/watch?v=6wBrOV2FJM8)

Original transcript

[1:05] The copper doesn't go right to the edge of the board, so I need to clean it up a little. [2:12] Flux... [2:19] Dabs of solder to hold everything in place [3:04] ...then reflow it and make it neat [3:46] The accelerometer was a late addition and needs some thin wires to connect up [4:11] *pow* [7:48] Adding some vaseline to the mould, to stop resin getting into the USB port [9:12] Timelapse [9:32] It changed colour!